TT Electronics/IRC

GUS-QS8B-01-2671-G

GUS-QS8B-01-2671-G Description

The GUS-QS8B-01-2671-G from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin QSOP package integrates 15 resistors with a 2.67KΩ resistance value, offering a tight 2% tolerance and a low ±100ppm/°C temperature coefficient. With a 0.75W (3/4W) total power rating (0.05W per resistor) and a 100V maximum voltage rating, it ensures reliable performance in compact, high-density circuits. The gull-wing termination and ±0.1mm height tolerance facilitate seamless PCB assembly, while its 4.9mm x 6.02mm footprint optimizes board space.

GUS-QS8B-01-2671-G Features

• High Precision: Thin-film technology ensures stable performance with ±100ppm/°C TCR and 2% tolerance.
• Robust Power Handling: 0.75W total dissipation (0.05W per resistor) at 125°C maximum operating temperature.
• Compact & Reliable: QSOP package with 1.47mm profile and 0.64mm terminal pitch for high-density designs.
• Wide Compatibility: BUS circuit designator simplifies integration into bus termination, pull-up/down, and voltage divider networks.
• Industrial-Grade: Non-automotive (PPAP No) but suitable for 70–125°C derated power range, ideal for industrial and telecom environments.

GUS-QS8B-01-2671-G Applications

• Signal Conditioning: Precision voltage division in ADC/DAC circuits.
• Bus Termination: Matched impedance for high-speed data lines (e.g., SPI, I²C).
• Embedded Systems: Space-constrained PCBs in IoT devices and sensors.
• Power Management: Bias networks and feedback loops in DC-DC converters.
• Test Equipment: Calibration circuits requiring low drift and repeatability.

Conclusion of GUS-QS8B-01-2671-G

The GUS-QS8B-01-2671-G excels in applications demanding miniaturization, precision, and thermal stability. Its thin-film construction, gull-wing SMD compatibility, and robust power rating make it superior to thicker-film or less stable alternatives. While not RoHS-compliant, it remains a top choice for industrial and communication systems where reliability outweighs regulatory constraints. Engineers will appreciate its balance of performance, size, and cost in high-density designs.