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GUS-QS8B-01-2702-JF
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GUS-QS8B-01-2702-JF Description
GUS-QS8B-01-2702-JF Description
The GUS-QS8B-01-2702-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin QSOP package integrates 15 resistors, each with a 27KΩ resistance value and a 5% tolerance, delivering a total power rating of 0.75W (3/4W). The device operates within a wide temperature range of -70°C to +125°C, ensuring stability in demanding environments. Its thin-film technology provides a low temperature coefficient of ±100ppm/°C, making it ideal for circuits requiring minimal resistance drift. The gull-wing termination ensures reliable solder joints, while the compact 4.9mm × 6.02mm × 1.47mm footprint suits space-constrained designs.
GUS-QS8B-01-2702-JF Features
- High-Density Integration: 15 resistors in a QSOP-16 package optimize board space.
- Precision Performance: ±100ppm/°C TCR and 5% tolerance ensure consistent signal integrity.
- Robust Construction: Thin-film technology enhances durability and long-term reliability.
- Wide Operating Range: Rated for -70°C to +125°C, suitable for industrial and automotive (non-AECQ) applications.
- Surface-Mount Ready: Gull-wing leads with 0.64mm pitch facilitate automated assembly.
- High Voltage Handling: Supports up to 100V, ideal for analog and digital signal conditioning.
GUS-QS8B-01-2702-JF Applications
This resistor network excels in:
- Analog Signal Processing: Voltage dividers, DAC/ADC interfaces.
- Industrial Control Systems: PLCs, sensor calibration circuits.
- Telecommunications: Line termination, impedance matching.
- Test & Measurement Equipment: Precision reference networks.
- Consumer Electronics: Audio amplifiers, display drivers.
Conclusion of GUS-QS8B-01-2702-JF
The GUS-QS8B-01-2702-JF combines high density, precision, and thermal stability, making it a superior choice for engineers seeking reliable resistor networks in compact designs. Its thin-film construction, wide temperature range, and robust packaging address challenges in industrial, telecom, and instrumentation applications. While not PPAP or automotive-qualified, it remains a cost-effective solution for non-AECQ environments requiring tight tolerance and low drift.



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