TT Electronics/IRC

GUS-QS8B-01-4641-J

GUS-QS8B-01-4641-J Description

The GUS-QS8B-01-4641-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin QSOP (Quarter-Small Outline Package) device integrates 15 resistors with a 4.64KΩ resistance value, offering a 5% tolerance and a ±100ppm/°C temperature coefficient. Rated for 0.75W (3/4W) total power and 0.05W (1/20W) per resistor, it operates reliably across a wide temperature range of 70°C to 125°C, with a maximum operating temperature of 125°C. The gull-wing termination ensures secure surface-mount (SMD) assembly, while the compact 4.9mm x 6.02mm x 1.47mm footprint suits space-constrained designs.

GUS-QS8B-01-4641-J Features

• High-Density Integration: 15 resistors in a QSOP-16 package optimize PCB space.
• Stable Performance: Thin-film technology ensures low noise and high accuracy (±5%).
• Robust Power Handling: 0.75W total dissipation with derating up to 125°C.
• Precision Tolerance: Tight ±100ppm/°C TCR minimizes drift in variable environments.
• Automated Assembly Friendly: Gull-wing leads and 0.64mm pitch enable high-speed SMT processes.
• Wide Voltage Rating: Supports up to 100V, suitable for industrial and telecom applications.
• Non-Automotive: Compliant with EAR99 (ECCN) but not PPAP or automotive-grade.

GUS-QS8B-01-4641-J Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers in ADC/DAC circuits.
• Industrial Control Systems: Stable feedback networks in PLCs and sensors.
• Telecommunications: Impedance matching and termination in high-frequency PCBs.
• Test & Measurement Equipment: Calibration circuits requiring low thermal drift.
• Medical Electronics: Reliable performance in diagnostic devices (non-implantable).

Conclusion of GUS-QS8B-01-4641-J

The GUS-QS8B-01-4641-J combines miniaturization, precision, and power efficiency, making it ideal for high-density, temperature-sensitive designs. Its thin-film construction and QSOP packaging provide superior stability over carbon or thick-film alternatives. While not RoHS-compliant, it remains a cost-effective solution for industrial, telecom, and instrumentation applications where space and performance are critical. Engineers will appreciate its balance of reliability, compactness, and ease of integration in surface-mount assemblies.