TT Electronics/IRC

GUS-QS8B-01-8250-JG

GUS-QS8B-01-8250-JG Description

The GUS-QS8B-01-8250-JG from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount circuits. This 16-pin QSOP package integrates 15 resistors, each with a 825Ω resistance value and a 5% tolerance, delivering a total power rating of 0.75W (3/4W). Its thin-film technology ensures excellent stability with a ±100ppm/°C temperature coefficient, making it ideal for environments with operating temperatures ranging from 70°C to 125°C. The gull-wing termination and 0.64mm terminal pitch facilitate reliable PCB mounting, while its compact dimensions (4.9mm × 6.02mm × 1.47mm) suit space-constrained designs.

GUS-QS8B-01-8250-JG Features

• High-Density Integration: 15 resistors in a 16-pin QSOP package optimize board space.
• Precision Performance: ±100ppm/°C TCR and 5% tolerance ensure consistent operation under thermal stress.
• Robust Power Handling: 0.05W per resistor (0.75W total) with a 100V maximum voltage rating.
• Surface-Mount Ready: Gull-wing leads and 0.64mm pitch for automated assembly compatibility.
• Wide Temperature Range: Operates reliably from -55°C to +125°C (derated power up to 125°C).
• Non-Automotive/Non-PPAP: Suitable for industrial and commercial applications.

GUS-QS8B-01-8250-JG Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces and ADC/DAC circuits.
• Communication Systems: Impedance matching in RF modules and high-frequency PCBs.
• Industrial Controls: PLC I/O modules requiring stable resistance under thermal cycling.
• Test & Measurement Equipment: Calibration networks for oscilloscopes and multimeters.
• Power Management: Current-limiting arrays in low-power DC/DC converters.

Conclusion of GUS-QS8B-01-8250-JG

The GUS-QS8B-01-8250-JG excels in high-density, precision applications where thermal stability and compact form factor are critical. Its thin-film construction and QSOP packaging offer superior performance over thicker-film or through-hole alternatives, particularly in signal integrity-sensitive designs. While not RoHS-compliant, it remains a robust choice for industrial, telecom, and instrumentation systems demanding reliability across extended temperature ranges.