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GUS-QS8B-02-1130-J
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GUS-QS8B-02-1130-J Description
GUS-QS8B-02-1130-J Description
The GUS-QS8B-02-1130-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin QSOP package integrates 15 resistors, each with a 113Ω resistance value and a tight 5% tolerance, ensuring consistent performance across demanding environments. With a 0.75W (3/4W) total power rating and 0.05W (1/20W) per resistor, it balances power handling with compactness. The device operates over a wide temperature range of 70°C to 125°C (derated) and withstands up to 125°C at full load, making it suitable for thermally challenging designs. Its ±50ppm/°C temperature coefficient ensures stability, while the 100V maximum voltage rating and gull-wing termination facilitate reliable SMT soldering.
GUS-QS8B-02-1130-J Features
- High-Density Integration: 15 resistors in a 4.9mm × 6.02mm QSOP package (1.47mm height) save board space.
- Precision Thin-Film Technology: Delivers low noise and stable performance vs. thick-film alternatives.
- Robust Power Handling: 0.75W total dissipation (0.05W/resistor) suits power-sensitive designs.
- Wide Thermal Range: Operates from 70°C to 125°C (derated) with a 125°C maximum operating temperature.
- Automated Assembly-Friendly: Gull-wing leads with 0.64mm pitch ensure compatibility with pick-and-place systems.
- Non-Automotive/Non-PPAP: Ideal for industrial, telecom, and consumer electronics where PPAP compliance isn’t required.
GUS-QS8B-02-1130-J Applications
This resistor network excels in:
- Signal Conditioning: Precision voltage dividers and pull-up/down networks in IoT devices and sensors.
- Analog/Digital Interfaces: Impedance matching for ADCs, DACs, and communication modules.
- Power Management: Current-limiting and feedback circuits in DC-DC converters and LED drivers.
- Industrial Controls: Durable performance in PLC I/O modules and motor drives.
- Test Equipment: Stable resistance for calibration and measurement circuits.
Conclusion of GUS-QS8B-02-1130-J
The GUS-QS8B-02-1130-J combines space efficiency, precision, and thermal resilience, making it a standout choice for compact, high-reliability designs. Its thin-film technology and QSOP packaging offer superior performance over thicker-film networks in applications demanding tight tolerances and low thermal drift. While not PPAP or automotive-grade, it is a cost-effective solution for industrial, consumer, and telecom systems where robust performance in moderate environments is critical. Engineers will appreciate its balance of power handling, density, and stability in SMT assemblies.



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