TT Electronics/IRC

GUS-QS8B-02-1272-C

GUS-QS8B-02-1272-C Description

The GUS-QS8B-02-1272-C from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin QSOP package integrates 15 resistors with a 12.7KΩ resistance value, offering a tight tolerance of ±0.25% and a low temperature coefficient of ±50ppm/°C. With a 0.75W (3/4W) total power rating and 0.05W (1/20W) per resistor, it operates reliably across a 70°C to 125°C derated power range, peaking at 125°C maximum operating temperature. Its gull-wing termination and 0.64mm terminal pitch ensure secure PCB mounting, while the compact 4.9mm x 6.02mm x 1.47mm footprint suits space-constrained designs.

GUS-QS8B-02-1272-C Features

• Precision Performance: 0.25% tolerance and ±50ppm/°C TCR ensure stability in precision analog circuits.
• Robust Power Handling: 0.75W total dissipation (0.05W/resistor) with 100V maximum voltage rating.
• Compact & Durable: QSOP package with thin-film technology for high reliability and minimal drift.
• Automation-Friendly: Gull-wing leads and surface-mount design streamline assembly processes.
• Wide Thermal Range: Operates from 70°C to 125°C (derated), ideal for industrial environments.

GUS-QS8B-02-1272-C Applications

• Precision Instrumentation: Ideal for DAC/ADC reference circuits, medical devices, and test equipment.
• Industrial Controls: Suitable for PLC modules, sensor interfaces, and power management systems.
• Communications: Used in RF signal conditioning and filtering due to low noise and high stability.
• Automotive (Non-Automotive Rated): Auxiliary systems where high-temperature resilience is critical.

Conclusion of GUS-QS8B-02-1272-C

The GUS-QS8B-02-1272-C excels in applications demanding precision, compactness, and thermal robustness. Its thin-film construction and tight electrical specs make it superior to thicker-film networks in stability-critical designs. While not PPAP or automotive-rated, it’s a cost-effective choice for industrial, medical, and communication hardware where consistent performance under thermal stress is paramount. The tube packaging further ensures handling efficiency for medium-volume production.