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GUS-QS8B-02-1581-D
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GUS-QS8B-02-1581-D Description
GUS-QS8B-02-1581-D Description
The GUS-QS8B-02-1581-D from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin QSOP package integrates 15 resistors with a 1.58KΩ resistance value, offering a tight ±0.5% tolerance and a low ±50ppm/°C temperature coefficient. With a 0.75W (3/4W) total power rating and 0.05W (1/20W) per resistor, it operates reliably across a 70°C to 125°C derated power range, peaking at 125°C maximum operating temperature. The gull-wing termination and 0.64mm terminal pitch ensure secure PCB mounting, while its compact 4.9mm × 6.02mm × 1.47mm footprint suits space-constrained designs.
GUS-QS8B-02-1581-D Features
- Precision Performance: Thin-film technology delivers 0.5% tolerance and ±50ppm/°C stability, ideal for signal conditioning and analog circuits.
- Robust Power Handling: 0.75W total dissipation (0.05W per resistor) with a 100V maximum voltage rating ensures reliability in high-density layouts.
- Compact & Durable: QSOP package with 1.63mm seated height and rectangular shape optimizes board space while resisting mechanical stress.
- Automation-Friendly: Gull-wing leads and tube packaging streamline pick-and-place assembly processes.
- Wide Thermal Range: Operates from 70°C to 125°C (derated), making it suitable for industrial and telecom environments.
GUS-QS8B-02-1581-D Applications
This resistor network excels in:
- Precision Analog Circuits: Voltage dividers, DAC/ADC interfaces, and sensor calibration due to low TCR and tight tolerance.
- Communication Systems: RF modules and signal filtering where consistent impedance matching is critical.
- Industrial Controls: PLCs and motor drivers requiring stable performance under thermal stress.
- Medical Electronics: Diagnostic equipment where component reliability and accuracy are paramount.
Conclusion of GUS-QS8B-02-1581-D
The GUS-QS8B-02-1581-D combines high precision, compact form factor, and robust power handling, making it a superior choice for engineers designing critical analog or mixed-signal systems. Its thin-film technology and QSOP packaging offer a competitive edge over bulkier or less stable alternatives, particularly in applications demanding thermal resilience and space efficiency. While not automotive-grade or RoHS-compliant, its performance in industrial, telecom, and medical sectors underscores its versatility and reliability.



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