TT Electronics/IRC

GUS-QS8B-02-2491-JG

GUS-QS8B-02-2491-JG Description

The GUS-QS8B-02-2491-JG from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin QSOP package integrates 15 resistors with a 2.49KΩ resistance value, offering a 5% tolerance and a ±50ppm/°C temperature coefficient for stable operation across a wide temperature range (70°C to 125°C). With a 0.75W (3/4W) total power rating (0.05W per resistor) and a 100V maximum voltage rating, it balances power handling with compact dimensions (4.9mm length × 6.02mm depth × 1.47mm height). The gull-wing termination ensures reliable solder joints in automated SMD processes, while the tube packaging facilitates handling during production.

GUS-QS8B-02-2491-JG Features

• Thin-Film Technology: Delivers superior accuracy, low noise, and stability compared to thick-film alternatives.
• High-Density Integration: 15 resistors in a QSOP-16 package save board space in compact designs.
• Robust Performance: Operates at derated power up to 125°C, ideal for thermally demanding environments.
• Precision Specifications: ±50ppm/°C TCR and 5% tolerance ensure consistent performance in signal conditioning and voltage division.
• Automation-Friendly: Gull-wing leads with 0.64mm pitch enable high-speed pick-and-place assembly.
• Non-Automotive/Non-PPAP: Suitable for industrial and commercial applications without stringent automotive compliance requirements.

GUS-QS8B-02-2491-JG Applications

• Signal Conditioning: Precision attenuation and filtering in ADC/DAC circuits.
• Voltage Division: Reference networks in power management ICs and sensor interfaces.
• Industrial Electronics: Durable performance in PLC modules, test equipment, and control systems.
• Consumer Electronics: Space-constrained applications like wearables and IoT devices.
• Telecom Infrastructure: Stable resistance in RF front-end matching networks.

Conclusion of GUS-QS8B-02-2491-JG

The GUS-QS8B-02-2491-JG excels in high-density, precision circuits where thermal stability, compactness, and repeatability are critical. Its thin-film construction and QSOP packaging make it a superior choice over bulkier or less stable alternatives, particularly in industrial and telecom systems. While not suited for automotive use, its cost-effective reliability positions it as a versatile solution for modern SMD designs.