TT Electronics/IRC

GUS-QS8B-02-4751-JF

GUS-QS8B-02-4751-JF Description

The GUS-QS8B-02-4751-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount configurations. This 16-pin QSOP package integrates 15 resistors with a 4.75KΩ resistance value, offering a 5% tolerance and a ±50ppm/°C temperature coefficient. Rated for 0.75W (3/4W) total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of 70°C to 125°C, with a maximum operating temperature of 125°C. Its gull-wing termination and compact dimensions (4.9mm x 6.02mm x 1.47mm) make it ideal for space-constrained PCB designs.

GUS-QS8B-02-4751-JF Features

• High Precision: Thin-film technology ensures stable performance with ±50ppm/°C TCR and 5% tolerance.
• Robust Power Handling: 0.75W total power rating (0.05W per resistor) with derating up to 125°C.
• Compact & Durable: QSOP package with gull-wing leads for reliable surface-mount assembly; ±0.1mm height/length tolerances.
• Wide Voltage Range: Supports up to 100V maximum voltage, suitable for industrial and automotive (non-AECQ) applications.
• Non-Compliant to EU RoHS: Note for specific regulatory considerations.

GUS-QS8B-02-4751-JF Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
• Industrial Control Systems: Stable resistance networks for PLCs and motor drivers.
• Test & Measurement Equipment: High-accuracy circuits in oscilloscopes or multimeters.
• Telecommunications: Impedance matching in RF modules (despite non-automotive status).

Conclusion of GUS-QS8B-02-4751-JF

The GUS-QS8B-02-4751-JF combines thin-film accuracy, compact form factor, and robust power handling, making it a versatile choice for precision electronics. While not PPAP or automotive-qualified, its wide temperature range and high-voltage tolerance suit demanding industrial and instrumentation applications. Engineers will appreciate its repeatable performance and ease of integration in high-density designs.