


TT Electronics/IRC
GUS-QS8B-02-6491-JF
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GUS-QS8B-02-6491-JF Description
GUS-QS8B-02-6491-JF Description
The GUS-QS8B-02-6491-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in compact surface-mount assemblies. This 16-pin QSOP package integrates 15 resistors, each with a 6.49KΩ resistance value and a tight ±5% tolerance, ensuring reliable signal conditioning and voltage division. With a 0.75W (3/4W) total power rating and 0.05W per resistor, it delivers robust performance in space-constrained designs. The device operates over a wide temperature range (-70°C to +125°C) and features a low ±50ppm/°C temperature coefficient, minimizing resistance drift in demanding environments. Its gull-wing termination and 0.64mm terminal pitch facilitate easy PCB integration.
GUS-QS8B-02-6491-JF Features
- High-Density Integration: 15 resistors in a compact 4.9mm x 6.02mm QSOP package optimize board space.
- Precision Thin-Film Technology: Delivers stable performance with ±50ppm/°C TCR and 5% tolerance.
- Robust Power Handling: 0.75W total power (0.05W per resistor) supports high-reliability applications.
- Wide Operating Range: Rated for -70°C to +125°C, suitable for industrial and automotive (non-AECQ) environments.
- Surface-Mount Ready: Gull-wing leads and 0.64mm pitch ensure compatibility with automated assembly.
- Non-RoHS Compliant: Ideal for legacy or specialized systems requiring leaded components.
GUS-QS8B-02-6491-JF Applications
- Signal Conditioning: Precision voltage dividers in test equipment and sensor interfaces.
- Industrial Controls: PLC modules, motor drives, and power supplies requiring stable resistance networks.
- Communications: RF front-end circuits and filter networks in base stations.
- Legacy Systems: Maintenance or upgrades for military/aerospace hardware (non-automotive PPAP).
- Medical Devices: Patient monitoring systems where low drift and reliability are critical.
Conclusion of GUS-QS8B-02-6491-JF
The GUS-QS8B-02-6491-JF excels in applications demanding miniaturization, precision, and thermal stability. Its thin-film construction, high power density, and wide temperature range make it a superior choice over thicker-film or carbon-based alternatives. While not RoHS-compliant, it remains indispensable for high-reliability, non-automotive systems where performance outweighs regulatory constraints. Engineers will value its repeatability, low TCR, and robust packaging in mission-critical designs.



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