TT Electronics/IRC

GUS-QS8B-03-1742-JF

GUS-QS8B-03-1742-JF Description

The GUS-QS8B-03-1742-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin QSOP (Quarter-Small Outline Package) device integrates 15 resistors, each with a 17.4KΩ resistance value and a 5% tolerance, delivering a total power rating of 0.75W (3/4W). Its thin-film technology ensures excellent stability, with a low temperature coefficient of ±25ppm/°C, making it ideal for environments with operating temperatures ranging from 70°C to 125°C. The gull-wing termination and surface-mount design facilitate easy PCB integration, while its compact dimensions (4.9mm x 6.02mm x 1.47mm) save board space.

GUS-QS8B-03-1742-JF Features

• High Precision: Thin-film construction ensures low TCR (±25ppm/°C) and 5% tolerance for reliable performance.
• Robust Power Handling: 0.05W per resistor (0.75W total) with a maximum voltage rating of 100V.
• Compact & Durable: QSOP package with ±0.1mm height/length tolerances for consistent mounting.
• Wide Temperature Range: Operates from 70°C to 125°C with derated power, suitable for industrial environments.
• Automotive & Industrial Compliance: EAR99 ECCN and non-RoHS status (check alternatives for RoHS needs).

GUS-QS8B-03-1742-JF Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
• Medical Electronics: Stable resistance networks in diagnostic equipment.
• Industrial Control Systems: Reliable performance in PLCs and motor drives.
• Test & Measurement: Low-drift circuits for high-accuracy instrumentation.
• Aerospace & Defense: Ruggedized applications requiring thin-film reliability.

Conclusion of GUS-QS8B-03-1742-JF

The GUS-QS8B-03-1742-JF combines thin-film precision, compact packaging, and high power density, making it a standout choice for engineers needing stable resistor networks in demanding environments. Its QSOP gull-wing design ensures compatibility with automated assembly, while the wide temperature range supports harsh conditions. For applications prioritizing accuracy, space efficiency, and thermal resilience, this model delivers superior performance over standard thick-film alternatives.