TT Electronics/IRC

GUS-QS8B-03-1801-GF

GUS-QS8B-03-1801-GF Description

The GUS-QS8B-03-1801-GF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin QSOP surface-mount device integrates 15 resistors, each with a 1.8KΩ resistance value and a tight 2% tolerance, ensuring consistent performance in demanding circuits. With a ±25ppm/°C temperature coefficient, it delivers exceptional stability across a wide operating range of -70°C to +125°C. The network supports a maximum voltage rating of 100V and offers a total power rating of 0.75W (3/4W), distributed as 0.05W (1/20W) per resistor. Its gull-wing termination and compact dimensions (4.9mm x 6.02mm x 1.47mm) make it ideal for space-constrained PCB designs.

GUS-QS8B-03-1801-GF Features

• Precision Thin Film Technology: Ensures low noise, high accuracy, and excellent thermal stability.
• High-Density Integration: 15 resistors in a QSOP-16 package optimize board space.
• Robust Performance: 125°C maximum operating temperature and ±25ppm/°C TCR suit harsh environments.
• Automated Assembly Friendly: Gull-wing leads and 0.64mm terminal pitch enable reliable SMT placement.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation applications.
• Tube Packaging: Protects components during handling and storage.

GUS-QS8B-03-1801-GF Applications

This resistor network excels in:

• Voltage Division & Signal Conditioning: Precision dividers in ADC/DAC circuits.
• Impedance Matching: High-frequency RF and communication systems.
• Industrial Control Systems: Stable performance in PLCs and sensor interfaces.
• Medical Electronics: Reliable operation in diagnostic equipment.
• Test & Measurement Gear: Low-drift performance for calibration circuits.

Conclusion of GUS-QS8B-03-1801-GF

The GUS-QS8B-03-1801-GF combines high precision, compact design, and thermal resilience, making it a superior choice for engineers requiring reliable resistor networks in critical applications. Its thin-film construction, tight tolerances, and robust packaging distinguish it from generic arrays, particularly in high-reliability industrial and telecom systems. For designs demanding stability under thermal stress and space efficiency, this model delivers unmatched performance.