TT Electronics/IRC

GUS-QS8B-03-1821-JF

GUS-QS8B-03-1821-JF Description

The GUS-QS8B-03-1821-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors, each with a 1.82KΩ resistance value and a 5% tolerance, ensuring reliable performance in compact circuit designs. With a 0.75W (3/4W) total power rating and 0.05W (1/20W) per resistor, it delivers robust power handling while maintaining stability across a wide temperature range of 70°C to 125°C. The ±25ppm/°C temperature coefficient guarantees minimal resistance drift, making it ideal for environments requiring thermal stability.

GUS-QS8B-03-1821-JF Features

• Circuit Designator: BUS configuration for streamlined integration.
• Thin Film Technology: Ensures high precision and low noise.
• Compact QSOP Package: Measures 4.9mm (L) x 6.02mm (D) x 1.47mm (H) with ±0.1mm length/height tolerances, ideal for space-constrained PCBs.
• Gull Wing Termination: Facilitates easy surface-mount (SMD) assembly with a 0.64mm terminal pitch.
• High Voltage Rating: Supports up to 100V, suitable for industrial and automotive-grade applications (though not PPAP or Automotive certified).
• Wide Operating Range: Functions reliably from -55°C to 125°C, with derated power up to 125°C.
• Non-RoHS Compliant: May be preferred for legacy or specialized systems requiring specific material properties.

GUS-QS8B-03-1821-JF Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, sensor interfaces, and signal conditioning.
• Industrial Control Systems: PLCs, motor drives, and power management modules.
• Telecommunications: RF and signal processing equipment.
• Test & Measurement: Calibration tools and instrumentation requiring stable resistance values.
• Legacy Electronics: Systems where RoHS compliance is not mandatory.

Conclusion of GUS-QS8B-03-1821-JF

The GUS-QS8B-03-1821-JF combines high power density, thermal stability, and compact form factor, making it a standout choice for engineers prioritizing reliability in dense PCB layouts. Its thin-film construction and tight tolerances outperform bulkier alternatives, while the QSOP package ensures compatibility with automated assembly processes. Though not RoHS-compliant, its robust design caters to niche and industrial applications demanding precision under thermal stress.