TT Electronics/IRC

GUS-QS8B-03-2552-J

GUS-QS8B-03-2552-J Description

The GUS-QS8B-03-2552-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. It features 15 resistors in a 16-pin QSOP package with a 25.5K Ohm resistance value and a tight ±5% tolerance. The device operates over a wide temperature range (70°C to 125°C) with a low temperature coefficient of ±25ppm/°C, ensuring stable performance under thermal stress. Rated for 0.75W (3/4W) total power dissipation and 0.05W (1/20W) per resistor, it supports 100V maximum voltage, making it suitable for demanding circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration.

GUS-QS8B-03-2552-J Features

• High Precision: Thin-film technology delivers low TCR (±25ppm/°C) and 5% tolerance for reliable signal conditioning.
• Robust Construction: QSOP package with ±0.1mm height/length tolerances ensures mechanical stability.
• Power Efficiency: 0.75W total power rating (0.05W per resistor) optimizes thermal management.
• Wide Voltage Range: Supports up to 100V, ideal for industrial and automotive environments (though not PPAP/Automotive certified).
• Compact Design: 4.9mm x 6.02mm footprint and 1.47mm profile save board space in dense layouts.

GUS-QS8B-03-2552-J Applications

This resistor network excels in:

• Analog Signal Processing: Precision dividers, DAC/ADC interfaces.
• Industrial Controls: PLCs, sensor calibration circuits.
• Test & Measurement Equipment: High-accuracy instrumentation.
• Power Management: Voltage regulation in non-automotive DC/DC converters.
• Communications: RF matching networks where stability is critical.

Conclusion of GUS-QS8B-03-2552-J

The GUS-QS8B-03-2552-J combines thin-film accuracy, compact packaging, and thermal resilience for advanced electronic systems. While not RoHS-compliant or automotive-grade, its 125°C rating and low TCR make it a standout for industrial and precision applications. Engineers will appreciate its balance of power handling and miniaturization, particularly in space-constrained, high-reliability designs.