TT Electronics/IRC

GUS-QS8B-03-3322-G

GUS-QS8B-03-3322-G Description

The GUS-QS8B-03-3322-G from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin QSOP (Quarter Small Outline Package) device integrates 15 resistors, each with a 33.2KΩ resistance value and a tight 2% tolerance. It operates over a wide temperature range of 70°C to 125°C (derated power) and delivers a total power rating of 0.75W (3/4W), with 0.05W (1/20W) per resistor. The ±25ppm/°C temperature coefficient ensures stability in varying thermal conditions, while the 100V maximum voltage rating enhances reliability in demanding circuits.

GUS-QS8B-03-3322-G Features

• Precision Thin Film Technology: Delivers low noise and high accuracy for sensitive analog/digital circuits.
• Compact QSOP Package: Measures 4.9mm (L) × 6.02mm (D) × 1.47mm (H) with gull-wing terminations for easy surface-mount assembly.
• Robust Performance: 125°C maximum operating temperature and ±0.1mm height tolerance ensure durability in harsh environments.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• Non-Automotive, Non-PPAP: Ideal for industrial, telecom, and instrumentation use where automotive compliance isn’t required.

GUS-QS8B-03-3322-G Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers in ADC/DAC circuits.
• Bus Termination: Impedance matching for high-speed data lines (e.g., SPI, I²C).
• Medical/Test Equipment: Stable performance in diagnostic and measurement systems.
• Power Management: Load sharing in low-power DC/DC converters.

Conclusion of GUS-QS8B-03-3322-G

The GUS-QS8B-03-3322-G combines high density, precision, and thermal stability in a compact QSOP format, making it superior to thicker-film or less stable alternatives. Its 2% tolerance, low TCR, and robust power handling cater to critical designs requiring repeatable performance. While not RoHS-compliant, it remains a top choice for industrial and telecom applications demanding reliability under thermal stress.