TT Electronics/IRC

GUS-QS8B-03-8662-JF

GUS-QS8B-03-8662-JF Description

The GUS-QS8B-03-8662-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount assemblies. This 16-pin QSOP package integrates 15 resistors, each with a 86.6KΩ resistance value and a 5% tolerance, delivering a total power rating of 0.75W (3/4W). The device operates within a wide temperature range of 70°C to 125°C and features a ±25ppm/°C temperature coefficient, ensuring stability under thermal stress. Its gull-wing termination and 0.64mm terminal pitch facilitate reliable PCB mounting, while the compact dimensions (4.9mm x 6.02mm x 1.47mm) make it ideal for space-constrained designs.

GUS-QS8B-03-8662-JF Features

• High-Density Integration: 15 resistors in a 16-pin QSOP package, optimizing board space.
• Precision Performance: ±25ppm/°C TCR and 5% tolerance for consistent operation in demanding environments.
• Robust Power Handling: 0.05W per resistor (0.75W total) with a 100V maximum voltage rating.
• Reliable Construction: Thin-film technology ensures low noise and high stability.
• Automated Assembly-Friendly: Gull-wing leads and surface-mount design streamline manufacturing.
• Extended Temperature Range: Operates from -55°C to +125°C (derated power at 70°C+).

GUS-QS8B-03-8662-JF Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
• Industrial Control Systems: Stable feedback networks in PLCs and motor drives.
• Medical Electronics: Low-noise circuits for diagnostic equipment.
• Telecommunications: Impedance matching in RF modules.
• Automotive (Non-Automotive Rated): Auxiliary circuits where EU RoHS non-compliance is permissible.

Conclusion of GUS-QS8B-03-8662-JF

The GUS-QS8B-03-8662-JF combines high density, precision, and thermal resilience, making it a superior choice for engineers prioritizing reliability in compact designs. While not PPAP or automotive-qualified, its thin-film technology and robust power handling cater to industrial, medical, and telecom applications requiring stable performance under thermal and electrical stress. Its QSOP package and gull-wing termination further enhance manufacturability, solidifying its role in advanced SMT assemblies.