TT Electronics/IRC

GUS-SS8B-01-1582-GD

GUS-SS8B-01-1582-GD Description

The GUS-SS8B-01-1582-GD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 15.8KΩ resistance and a tight 2% tolerance, ensuring reliable signal conditioning and voltage division. With a ±100ppm/°C temperature coefficient, it delivers stable performance across a wide operating range of -55°C to +125°C. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Its gull-wing termination and surface-mount design facilitate automated assembly, while the tube packaging ensures handling efficiency.

GUS-SS8B-01-1582-GD Features

• Precision Thin Film Technology: Offers low noise and high stability for sensitive analog/digital circuits.
• Compact SOIC Package: 9.91mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances for space-constrained PCBs.
• Robust Performance: Derated power up to 125°C and ±100ppm/°C TCR ensure reliability in harsh environments.
• Automation-Friendly: Gull-wing leads with 1.27mm pitch enable seamless SMD placement.
• BUS Circuit Designator: Optimized for bus termination, pull-up/pull-down networks, and voltage dividers.

GUS-SS8B-01-1582-GD Applications

• Industrial Electronics: Signal conditioning in PLCs, motor drives, and instrumentation.
• Telecommunications: Impedance matching and line termination in high-speed data systems.
• Medical Devices: Precision voltage division in diagnostic equipment.
• Automotive (Non-Automotive Rated): Sensor interfaces and control modules (where PPAP compliance isn’t required).
• Consumer Electronics: Dense PCB designs requiring stable resistor networks.

Conclusion of GUS-SS8B-01-1582-GD

The GUS-SS8B-01-1582-GD stands out for its precision, compactness, and thermal resilience, making it ideal for applications demanding tight tolerance and repeatability. While not PPAP or automotive-grade, its thin-film technology and SOIC form factor provide a competitive edge in industrial and telecom markets. Engineers will appreciate its balance of performance, size, and cost-efficiency in high-density designs.