TT Electronics/IRC

GUS-SS8B-01-1650-GF

GUS-SS8B-01-1650-GF Description

The GUS-SS8B-01-1650-GF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin SOIC package features 15 resistors with a 165Ω resistance value, 2% tolerance, and a ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this surface-mount (SMD) device is ideal for compact, high-density PCB designs. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable soldering and automated assembly.

GUS-SS8B-01-1650-GF Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
• Robust Construction: SOIC package (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth) ensures mechanical reliability.
• Wide Operating Range: Functions reliably from 70°C to 125°C with derated power, suitable for industrial environments.
• High Power Density: 0.8W total dissipation in a compact footprint, outperforming similar networks in power handling.
• Automation-Friendly: Gull-wing leads and tube packaging streamline pick-and-place assembly.
• Non-Automotive (PPAP No): Optimized for industrial, telecom, and instrumentation use.

GUS-SS8B-01-1650-GF Applications

• Voltage Divider Networks: Precision signal conditioning in data acquisition systems.
• Termination Resistor Arrays: High-speed digital circuits (e.g., LVDS, PCIe) requiring impedance matching.
• Sensor Interface Modules: Stable biasing for RTDs, strain gauges, and bridge circuits.
• Medical Electronics: Patient monitoring equipment where low drift and reliability are critical.
• Test & Measurement: Calibration tools and reference circuits demanding tight tolerance (±2%).

Conclusion of GUS-SS8B-01-1650-GF

The GUS-SS8B-01-1650-GF combines thin-film precision, compact SOIC packaging, and high power efficiency, making it a superior choice for engineers designing high-reliability systems. Its wide temperature range and low TCR (±100ppm/°C) address challenges in industrial and telecom applications, while the gull-wing termination ensures manufacturability. Though non-compliant with EU RoHS, its performance-centric design justifies its use in specialized sectors where durability and accuracy are paramount.