TT Electronics/IRC

GUS-SS8B-01-1692-J

GUS-SS8B-01-1692-J Description

The GUS-SS8B-01-1692-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 16.9KΩ resistance value and a 5% tolerance, ensuring reliable performance in compact designs. With a 0.8W total power rating (0.05W per resistor) and a ±100ppm/°C temperature coefficient, it delivers stable operation across a wide temperature range (70°C to 125°C). The gull-wing termination and surface-mount design facilitate easy PCB integration, while the 100V maximum voltage rating makes it suitable for moderate-voltage circuits.

GUS-SS8B-01-1692-J Features

• Precision Thin Film Technology: Ensures low noise and high accuracy for sensitive circuits.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Robust Performance: Operates at up to 125°C with derated power handling at elevated temperatures.
• BUS Circuit Designator: Optimized for bus line termination and pull-up/down applications.
• Non-Automotive, Non-PPAP: Ideal for industrial and commercial electronics where PPAP compliance is not required.
• 16-Terminal Gull Wing SMD: Ensures secure soldering and mechanical stability.

GUS-SS8B-01-1692-J Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers and feedback networks in analog circuits.
• Bus Termination: Effective impedance matching for digital communication lines (e.g., I2C, SPI).
• Embedded Systems: Space-constrained designs requiring multiple resistors in a single footprint.
• Test & Measurement Equipment: Stable performance in calibration and sensor interface circuits.
• Power Management: Auxiliary circuits in DC-DC converters or load-sharing applications.

Conclusion of GUS-SS8B-01-1692-J

The GUS-SS8B-01-1692-J combines high-density integration, thermal stability, and ease of assembly, making it a versatile choice for engineers prioritizing reliability in compact layouts. Its thin-film construction and tight tolerance outperform carbon-based networks, while the SOIC package ensures compatibility with standard SMD processes. Though not RoHS-compliant, it remains a robust solution for industrial and instrumentation applications demanding precision and durability.