TT Electronics/IRC

GUS-SS8B-01-1871-JD

GUS-SS8B-01-1871-JD Description

The GUS-SS8B-01-1871-JD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin SOIC (Small Outline Integrated Circuit) package integrates 15 resistors with a 1.87K Ohm resistance value and a 5% tolerance, offering reliable performance in compact surface-mount designs. With a 0.8W total power rating (0.05W per resistor) and a ±100ppm/°C temperature coefficient, it ensures stable operation across a wide temperature range of 70°C to 125°C. The gull-wing termination and 100V maximum voltage rating make it suitable for automated PCB assembly and high-voltage environments.

GUS-SS8B-01-1871-JD Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog and digital circuits.
• Compact SOIC Package: Measures 9.91mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm length/height, ±0.2mm depth).
• High Power Handling: 0.8W total dissipation (0.05W per resistor) at 125°C maximum operating temperature.
• Automation-Friendly: Gull-wing leads and 1.27mm terminal pitch ensure compatibility with pick-and-place systems.
• Broad Compatibility: Ideal for BUS circuit applications (designated by "BUS" circuit designator).
• Non-Automotive/Non-PPAP: Suitable for industrial, telecom, and consumer electronics (not automotive-qualified).

GUS-SS8B-01-1871-JD Applications

This resistor network excels in:

• Voltage Division & Signal Conditioning: Precision dividers in ADC/DAC circuits.
• Bus Termination & Pull-Up/Down Networks: Ensures signal integrity in high-speed digital systems (e.g., I²C, SPI).
• Industrial Control Systems: Stable performance in harsh environments (e.g., PLCs, motor drives).
• Telecom Infrastructure: Reliable operation in RF and baseband processing units.
• Consumer Electronics: Space-constrained designs like wearables and IoT devices.

Conclusion of GUS-SS8B-01-1871-JD

The GUS-SS8B-01-1871-JD combines thin-film precision, compact form factor, and robust power handling, making it a versatile choice for engineers prioritizing reliability in dense PCB layouts. While not RoHS-compliant or automotive-grade, its wide temperature range and low TCR (±100ppm/°C) cater to industrial and telecom applications where stability is critical. Its SOIC-16 package and gull-wing leads further streamline manufacturing efficiency, solidifying its role in modern electronic systems.