TT Electronics/IRC

GUS-SS8B-01-2002-F

GUS-SS8B-01-2002-F Description

The GUS-SS8B-01-2002-F from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors with a 20K Ohm resistance value, offering 1% tolerance and a ±100ppm/°C temperature coefficient. With a 0.8W total power rating (0.05W per resistor) and a maximum operating temperature of 125°C, it ensures reliable performance in demanding environments. The gull-wing termination and surface-mount design facilitate easy PCB integration, while its compact dimensions (9.91mm x 5.99mm x 1.45mm) make it suitable for space-constrained designs.

GUS-SS8B-01-2002-F Features

• Precision Thin Film Technology: Delivers stable resistance values with low TCR (±100ppm/°C) and tight tolerance (1%).
• High Power Handling: 0.8W total power dissipation (0.05W per resistor) with derating up to 125°C.
• Robust Construction: SOIC package with gull-wing leads ensures mechanical durability and solderability.
• Wide Voltage Range: Supports up to 100V maximum voltage rating, ideal for mixed-signal circuits.
• Automated Assembly Friendly: Surface-mount design with 1.27mm terminal pitch for efficient PCB placement.
• Non-Automotive, Non-PPAP: Suitable for industrial and commercial applications where PPAP compliance is not required.

GUS-SS8B-01-2002-F Applications

This resistor network excels in:

• Precision Analog Circuits: Voltage dividers, feedback networks, and sensor conditioning.
• Signal Processing: DAC/ADC reference networks, gain setting, and impedance matching.
• Industrial Electronics: PLCs, test equipment, and power management systems.
• Telecommunications: Line termination and filtering in high-frequency applications.
• Medical Devices: Low-noise, high-stability circuits for diagnostic equipment.

Conclusion of GUS-SS8B-01-2002-F

The GUS-SS8B-01-2002-F combines precision, power efficiency, and compactness, making it a versatile solution for high-reliability electronic systems. Its thin-film technology and robust packaging provide superior performance over thick-film alternatives, particularly in environments requiring thermal stability and long-term accuracy. While not automotive-grade, it is ideal for industrial, telecom, and medical applications where consistent performance is critical.