TT Electronics/IRC

GUS-SS8B-01-2100-DD

GUS-SS8B-01-2100-DD Description

The GUS-SS8B-01-2100-DD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors with a 210Ω resistance value, offering a tight tolerance of ±0.5% and a low temperature coefficient of ±100ppm/°C. With a 0.8W total power rating (0.05W per resistor), it operates reliably across a wide temperature range of 70°C to 125°C, making it suitable for environments requiring stable performance under thermal stress. The gull-wing termination ensures secure PCB mounting, while the compact dimensions (9.91mm x 5.99mm x 1.45mm) optimize space efficiency.

GUS-SS8B-01-2100-DD Features

• Precision Thin Film Technology: Delivers superior accuracy (±0.5%) and stability (±100ppm/°C) for critical circuits.
• Robust Construction: SOIC package with gull-wing leads ensures mechanical durability and ease of assembly.
• High Power Handling: 0.8W total dissipation (0.05W per resistor) supports energy-intensive applications.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
• Automation-Friendly: Tube packaging facilitates pick-and-place processes in high-volume manufacturing.
• BUS Configuration: Ideal for bus termination, voltage division, and pull-up/down networks in digital systems.

GUS-SS8B-01-2100-DD Applications

This resistor network excels in:

• Analog/Digital Signal Conditioning: Precision voltage dividers in ADCs/DACs.
• Bus Termination: Impedance matching for high-speed data lines (e.g., DDR, PCIe).
• Industrial Controls: Stable feedback networks in PLCs and motor drivers.
• Test & Measurement Equipment: Calibration circuits requiring low drift.
• Aerospace & Defense: Reliable performance in harsh environments due to thin-film robustness.

Conclusion of GUS-SS8B-01-2100-DD

The GUS-SS8B-01-2100-DD stands out for its precision, power efficiency, and compact design, making it a top choice for engineers designing high-reliability systems. Its thin-film technology and wide temperature range address challenges in industrial, automotive (non-PPAP), and communication applications. For designs demanding tight tolerances and thermal stability, this network offers a cost-effective, space-saving solution without compromising performance.