TT Electronics/IRC

GUS-SS8B-01-2211-FF

GUS-SS8B-01-2211-FF Description

The GUS-SS8B-01-2211-FF from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors with a 2.21KΩ resistance value, offering 1% tolerance and a ±100ppm/°C temperature coefficient for stable performance across a -70°C to +125°C operating range. With a 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating, it ensures reliability in compact, high-density circuits. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB assembly, while the 9.91mm × 5.99mm × 1.45mm dimensions optimize space efficiency.

GUS-SS8B-01-2211-FF Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
• Robust Construction: SOIC package with ±0.1mm length/height tolerances ensures mechanical consistency.
• Wide Temperature Range: Operates from -70°C to +125°C with derated power handling at elevated temperatures.
• High Voltage Tolerance: Supports up to 100V, making it suitable for industrial and instrumentation use.
• Automated Assembly-Friendly: Gull-wing leads and standard SOIC footprint streamline SMT processes.
• Non-Automotive (PPAP No): Ideal for non-automotive industrial, telecom, and medical applications.

GUS-SS8B-01-2211-FF Applications

• Signal Conditioning: Precision voltage dividers in data acquisition systems.
• Medical Electronics: Patient monitoring devices requiring stable resistance over temperature fluctuations.
• Test & Measurement Equipment: Calibration circuits and reference networks.
• Industrial Controls: Feedback networks in power supplies and motor drives.
• Telecom Infrastructure: Impedance matching in high-frequency communication modules.

Conclusion of GUS-SS8B-01-2211-FF

The GUS-SS8B-01-2211-FF excels in applications demanding tight tolerance, thermal stability, and compact form factors. Its thin-film technology and rugged SOIC package provide a competitive edge over thicker-film networks, particularly in environments with thermal cycling or precision requirements. While not RoHS-compliant, it remains a top choice for legacy or specialized systems where reliability outweighs regulatory constraints. Engineers will appreciate its balance of performance, size, and ease of integration in high-reliability designs.