TT Electronics/IRC

GUS-SS8B-01-2371-JF

GUS-SS8B-01-2371-JF Description

The GUS-SS8B-01-2371-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 2.37KΩ resistance (5% tolerance) and a ±100ppm/°C temperature coefficient, ensuring stable performance across a 70°C to 125°C derated power range. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this surface-mount (SMD) network is ideal for compact, high-density PCB designs. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable soldering, while the 9.91mm × 5.99mm × 1.45mm dimensions (±0.1–0.2mm tolerances) ensure compatibility with automated assembly processes.

GUS-SS8B-01-2371-JF Features

• Thin-film technology: Delivers superior accuracy and low noise compared to thick-film alternatives.
• High power density: 0.8W total dissipation in a compact SOIC package, ideal for space-constrained designs.
• Wide temperature range: Operates reliably from -55°C to 125°C (derated to 70°C–125°C for full power).
• Robust construction: Rectangular SOIC case with gull-wing leads for mechanical stability and solderability.
• Non-automotive/PPAP-exempt: Suitable for industrial, telecom, and instrumentation applications where PPAP compliance isn’t required.
• Non-RoHS: Note for applications exempt from RoHS restrictions.

GUS-SS8B-01-2371-JF Applications

• Precision analog circuits: Voltage dividers, feedback networks, and sensor conditioning in test/measurement equipment.
• Signal processing: DAC/ADC reference networks, gain-setting resistors in audio/communication systems.
• Power management: Current-limiting and pull-up/pull-down arrays in power supplies or microcontroller interfaces.
• Industrial controls: Distributed resistor networks for PLCs and motor drives where temperature stability is critical.

Conclusion of GUS-SS8B-01-2371-JF

The GUS-SS8B-01-2371-JF excels in high-reliability, precision applications requiring tight tolerance and thermal stability. Its thin-film construction, compact SOIC package, and balanced power-to-size ratio make it a standout choice for engineers prioritizing performance in constrained layouts. While not suited for automotive or RoHS-mandated designs, it offers exceptional value for industrial, telecom, and instrumentation use cases demanding repeatable accuracy under thermal stress.