TT Electronics/IRC

GUS-SS8B-01-2740-GD

GUS-SS8B-01-2740-GD Description

The GUS-SS8B-01-2740-GD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 274Ω resistance value and a tight 2% tolerance, ensuring consistent performance in demanding circuits. With a 0.8W total power rating (0.05W per resistor) and a ±100ppm/°C temperature coefficient, it delivers stable operation across a wide temperature range of 70°C to 125°C. The gull-wing termination and surface-mount design facilitate easy PCB integration, while its 100V maximum voltage rating makes it suitable for various electronic systems.

GUS-SS8B-01-2740-GD Features

• Precision Thin Film Technology: Offers low noise and high stability for sensitive analog/digital circuits.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm length/height, ±0.2mm depth).
• High Power Density: 0.8W total dissipation in a small footprint, ideal for space-constrained designs.
• Wide Operating Range: Reliable performance from -55°C to 125°C (derated power up to 125°C).
• Robust Construction: Non-automotive but suitable for industrial, telecom, and instrumentation applications.
• Non-RoHS Compliant: May be preferred for legacy or specialized systems requiring leaded components.

GUS-SS8B-01-2740-GD Applications

• Voltage Divider Networks: Precision attenuation in sensor interfaces or ADCs.
• Signal Conditioning: Stable resistance paths in op-amp circuits or filters.
• Industrial Control Systems: Durable performance in PLCs, motor drives, and power supplies.
• Telecommunications: Impedance matching and termination in RF/high-speed PCBs.
• Test & Measurement Equipment: Low-drift resistance for calibration circuits.

Conclusion of GUS-SS8B-01-2740-GD

The GUS-SS8B-01-2740-GD excels in precision, power efficiency, and compactness, making it a standout choice for engineers needing reliable resistor networks. Its thin-film technology, tight tolerances, and robust SOIC package address challenges in industrial and telecom designs, while the non-RoHS compliance ensures compatibility with legacy systems. For applications demanding stable resistance under thermal stress, this model offers a compelling balance of performance and durability.