TT Electronics/IRC

GUS-SS8B-01-2742-FC

GUS-SS8B-01-2742-FC Description

The GUS-SS8B-01-2742-FC from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors, each with a 27.4KΩ resistance and a tight 1% tolerance, ensuring consistent performance in precision circuits. With a ±100ppm/°C temperature coefficient, it maintains stability across a wide operating range of -55°C to +125°C, derated up to 125°C. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for low-power, high-reliability designs. Its gull-wing termination and 1.27mm terminal pitch facilitate easy PCB assembly.

GUS-SS8B-01-2742-FC Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog circuits.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• High Power Density: 0.8W total dissipation in a small footprint, ideal for space-constrained designs.
• Wide Temperature Range: Reliable performance from -55°C to +125°C, with derating up to 125°C.
• Automated Assembly-Friendly: Gull-wing leads and standard SOIC footprint streamline SMT processes.
• Non-Automotive, Non-PPAP: Suitable for industrial, medical, and telecom applications where PPAP compliance isn’t required.

GUS-SS8B-01-2742-FC Applications

• Precision Voltage Dividers: Used in sensor interfaces and ADC/DAC circuits due to low TCR and tight tolerance.
• Signal Conditioning: Ideal for op-amp feedback networks and filter circuits in test equipment.
• Industrial Control Systems: Robust performance in PLCs and motor drives where temperature fluctuations occur.
• Medical Devices: Reliable operation in patient monitoring systems, benefiting from thin-film stability.
• Telecom Infrastructure: Suitable for RF matching networks and base station circuitry.

Conclusion of GUS-SS8B-01-2742-FC

The GUS-SS8B-01-2742-FC excels in applications requiring precision, compactness, and thermal resilience. Its thin-film construction, high power density, and industry-standard package make it a versatile choice for engineers designing high-reliability electronics. While not automotive-grade, its performance in industrial, medical, and telecom systems underscores its value in critical circuits where accuracy and stability are paramount.