TT Electronics/IRC

GUS-SS8B-01-2941-GD

GUS-SS8B-01-2941-GD Description

The GUS-SS8B-01-2941-GD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin SOIC package integrates 15 resistors with a 2.94KΩ resistance value, offering a tight 2% tolerance and a low ±100ppm/°C temperature coefficient. Rated for 0.8W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of 70°C to 125°C, with a maximum operating temperature of 125°C. Its gull-wing termination ensures secure soldering, while the compact 9.91mm × 5.99mm × 1.45mm footprint suits space-constrained designs.

GUS-SS8B-01-2941-GD Features

• Precision Thin Film Technology: Delivers stable performance with low noise and high accuracy.
• Robust Power Handling: 0.8W total power rating (1/20W per resistor) for demanding circuits.
• Wide Voltage Range: Supports up to 100V maximum voltage, ideal for industrial and automotive systems.
• Temperature Resilience: Operates from 70°C to 125°C with derated power, ensuring reliability in harsh environments.
• Compact SOIC Package: 16-pin gull-wing SMD design with ±0.1mm height/length tolerances for consistent mounting.
• BUS Circuit Designator: Optimized for bus line termination, voltage division, and pull-up/down applications.

GUS-SS8B-01-2941-GD Applications

• Industrial Electronics: Precision signal conditioning, ADC/DAC interfaces, and sensor networks.
• Automotive Systems (non-Automotive PPAP): Engine control units (ECUs) and infotainment systems requiring stable resistance.
• Telecommunications: Impedance matching and termination in high-frequency RF modules.
• Medical Devices: Low-noise analog circuits where consistent performance is critical.
• Test & Measurement Equipment: Calibration and reference circuits due to its tight tolerance.

Conclusion of GUS-SS8B-01-2941-GD

The GUS-SS8B-01-2941-GD excels in applications demanding precision, thermal stability, and compactness. Its thin-film construction, high power rating, and robust voltage handling make it superior to thicker-film or carbon-based alternatives. While not PPAP-compliant, it is a cost-effective solution for industrial, telecom, and medical designs where reliability and accuracy are paramount. The SOIC package ensures compatibility with automated assembly processes, reducing manufacturing overhead.