
TT Electronics/IRC
GUS-SS8B-01-3000-FF
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GUS-SS8B-01-3000-FF Description
GUS-SS8B-01-3000-FF Description
The GUS-SS8B-01-3000-FF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. Encased in a 16-pin SOIC package with gull-wing terminations, this 300Ω network features 15 resistors with a tight 1% tolerance and a low ±100ppm/°C temperature coefficient. Its 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating ensure reliable operation in demanding circuits. The device operates across a -70°C to +125°C temperature range, making it suitable for industrial and commercial environments. With a compact 9.91mm × 5.99mm × 1.45mm footprint and surface-mount (SMD) design, it optimizes PCB space while delivering stable performance.
GUS-SS8B-01-3000-FF Features
- Precision Thin Film Technology: Ensures low noise and high stability.
- 16-Pin SOIC Gull Wing Package: Facilitates automated assembly and robust mechanical connections.
- 1% Tolerance & ±100ppm/°C TCR: Ideal for precision analog and signal conditioning circuits.
- Wide Operating Range: Derated power up to 125°C for harsh environments.
- 300Ω Resistance per Resistor: Balanced performance for bus termination and voltage division.
- 0.8W Total Power Dissipation: Higher power handling than standard networks.
- Non-Automotive (PPAP No): Optimized for industrial and telecom applications.
GUS-SS8B-01-3000-FF Applications
This resistor network excels in:
- Bus Termination: Stable impedance matching in high-speed data lines (e.g., DDR, PCIe).
- Voltage Dividers: Precision reference circuits in ADCs/DACs.
- Signal Conditioning: Amplifier feedback networks and sensor interfaces.
- Industrial Controls: PLCs and instrumentation requiring tight tolerance.
- Telecom Hardware: Line drivers and receiver circuits.
Conclusion of GUS-SS8B-01-3000-FF
The GUS-SS8B-01-3000-FF combines precision, power efficiency, and compactness, addressing critical needs in high-reliability electronics. Its thin-film construction and SOIC packaging offer superior performance over thick-film alternatives, while the wide temperature range ensures versatility. Though non-compliant with EU RoHS, it remains a top choice for non-automotive industrial designs where accuracy and durability are paramount. Engineers will value its repeatability in batch production and ease of integration into dense PCB layouts.



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