TT Electronics/IRC

GUS-SS8B-01-3242-D

GUS-SS8B-01-3242-D Description

The GUS-SS8B-01-3242-D from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding electronic applications. This 16-pin SOIC (Small Outline Integrated Circuit) device integrates 15 resistors, each with a 32.4KΩ resistance value and a tight 0.5% tolerance, ensuring exceptional accuracy. The network operates within a wide temperature range of 70°C to 125°C (derated) and features a ±100ppm/°C temperature coefficient, making it stable under thermal stress. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it is engineered for reliability in compact, surface-mount designs. The gull-wing termination and 1.27mm terminal pitch facilitate easy PCB integration.

GUS-SS8B-01-3242-D Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive circuits.
• Compact SOIC Package: 9.91mm × 5.99mm × 1.45mm dimensions with tight tolerances (±0.1mm length/height, ±0.2mm depth) save board space.
• High Power Density: 0.8W total dissipation in a small footprint, outperforming similar networks.
• Automotive-Grade Alternatives: While not automotive-qualified (PPAP: No), its 125°C max operating temperature suits industrial and telecom applications.
• Non-RoHS Compliant: Ideal for legacy or specialized systems where RoHS exemptions apply.

GUS-SS8B-01-3242-D Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers in instrumentation and sensor interfaces.
• Medical Electronics: Stable feedback networks in diagnostic equipment.
• Industrial Control Systems: Robust performance in PLCs and motor drives.
• Telecom Infrastructure: Impedance matching and filtering in high-frequency modules.

Conclusion of GUS-SS8B-01-3242-D

The GUS-SS8B-01-3242-D combines precision, power efficiency, and compactness, making it a standout choice for engineers needing reliable resistor networks in space-constrained, high-performance designs. Its thin-film technology and tight tolerances ensure long-term stability, while the SOIC package simplifies assembly. For applications demanding accuracy under thermal stress, this model offers a compelling balance of performance and durability.