TT Electronics/IRC

GUS-SS8B-01-3400-GD

GUS-SS8B-01-3400-GD Description

The GUS-SS8B-01-3400-GD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 340Ω resistance value and a tight 2% tolerance, ensuring reliable signal conditioning and voltage division. With a ±100ppm/°C temperature coefficient, it maintains stable performance across a wide operating range of -70°C to +125°C. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding circuits. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GUS-SS8B-01-3400-GD Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
• Robust Construction: SOIC package (9.91mm x 5.99mm x 1.45mm) with ±0.1mm length/height tolerances for consistent placement.
• High-Temperature Resilience: Operates reliably up to 125°C, ideal for industrial and automotive-adjacent environments (though not PPAP/automotive-certified).
• Optimized Power Handling: 0.8W total dissipation (1/20W per resistor) balances compact size with thermal performance.
• BUS Circuit Designator: Simplifies integration into bus line termination, pull-up/pull-down networks, and voltage dividers.

GUS-SS8B-01-3400-GD Applications

• Signal Conditioning: Precision attenuation in ADC/DAC interfaces and sensor signal chains.
• Voltage Division: Stable reference networks in power supplies and measurement equipment.
• Bus Termination: Impedance matching for I²C, SPI, or other digital communication lines.
• Industrial Electronics: Control systems, PLCs, and instrumentation requiring high-temperature stability.
• Consumer Electronics: Compact designs needing reliable resistor arrays with minimal footprint.

Conclusion of GUS-SS8B-01-3400-GD

The GUS-SS8B-01-3400-GD excels in applications demanding precision, thermal resilience, and space efficiency. Its thin-film technology, tight tolerances, and robust SOIC package offer superior performance over thicker-film or less stable alternatives. While not RoHS-compliant, it remains a top choice for non-consumer industrial and communication systems where reliability under thermal stress is critical. Engineers will appreciate its balance of power handling, compactness, and ease of integration in high-density PCB layouts.