TT Electronics/IRC

GUS-SS8B-01-3652-G

GUS-SS8B-01-3652-G Description

The GUS-SS8B-01-3652-G from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 36.5K Ohm resistance and a tight 2% tolerance, ensuring reliable signal conditioning and voltage division. With a 0.8W total power rating (0.05W per resistor) and a ±100ppm/°C temperature coefficient, it delivers stable performance across a wide temperature range (70°C to 125°C). The gull-wing termination and surface-mount design facilitate easy PCB integration, while the 100V maximum voltage rating suits medium-voltage circuits. Its compact dimensions (9.91mm x 5.99mm x 1.45mm) and ±0.1mm height tolerance make it ideal for space-constrained designs.

GUS-SS8B-01-3652-G Features

• Precision Thin Film Technology: Ensures low noise and high stability for sensitive analog circuits.
• High-Density Integration: 15 resistors in a 16-pin SOIC package reduce board footprint.
• Robust Performance: 0.8W total power dissipation and 125°C maximum operating temperature for demanding environments.
• Automated Assembly Friendly: Gull-wing leads and 1.27mm terminal pitch compatible with pick-and-place systems.
• Wide Voltage Range: Supports up to 100V, suitable for industrial and instrumentation applications.
• Non-Automotive Grade: Optimized for general-purpose use, though not PPAP-compliant.

GUS-SS8B-01-3652-G Applications

• Signal Conditioning: Ideal for op-amp feedback networks and ADC/DAC interfaces.
• Voltage Division: Precision dividers in test equipment or sensor circuits.
• Industrial Controls: PLCs, motor drives, and power supplies requiring stable resistance values.
• Medical Electronics: Patient monitoring systems where low drift is critical.
• Communication Systems: RF modules and baseband processing requiring tight tolerance networks.

Conclusion of GUS-SS8B-01-3652-G

The GUS-SS8B-01-3652-G combines precision, power efficiency, and compactness, making it a standout choice for engineers designing high-reliability analog systems. Its thin-film construction and ±100ppm/°C TCR outperform carbon-based networks, while the SOIC package ensures compatibility with standard SMD processes. Though not RoHS-compliant, its thermal stability and 2% tolerance make it a cost-effective solution for industrial, medical, and communication applications where accuracy and durability are paramount.