TT Electronics/IRC

GUS-SS8B-01-3830-DD

GUS-SS8B-01-3830-DD Description

The GUS-SS8B-01-3830-DD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC device integrates 15 resistors with a 383Ω resistance value, offering a tight tolerance of ±0.5% and a low temperature coefficient of ±100ppm/°C. With a 0.8W total power rating (0.05W per resistor), it operates reliably across a wide temperature range of 70°C to 125°C, making it suitable for environments requiring stable performance under thermal stress. The gull-wing termination ensures secure PCB mounting, while the compact 9.91mm × 5.99mm × 1.45mm footprint optimizes board space.

GUS-SS8B-01-3830-DD Features

• Precision Performance: Thin-film technology ensures low noise, high stability, and excellent TCR (±100ppm/°C).
• Robust Construction: SOIC package with gull-wing leads for mechanical durability and solderability.
• High Power Handling: 0.8W total dissipation (0.05W per resistor) at 125°C, derated for extended reliability.
• Automation-Friendly: Supplied in tube packaging for efficient pick-and-place assembly.
• Voltage Resilience: Supports up to 100V maximum voltage, ideal for signal conditioning and divider circuits.
• Strict Tolerances: ±0.1mm length/height and ±0.2mm depth tolerances ensure consistent placement.

GUS-SS8B-01-3830-DD Applications

This resistor network excels in precision analog and digital systems, including:

• Signal Conditioning: Voltage dividers, feedback networks in op-amp circuits.
• Medical Electronics: Patient monitoring equipment requiring low drift.
• Industrial Controls: PLCs, sensor interfaces, and power management modules.
• Test & Measurement: Calibration tools and high-accuracy instrumentation.
• Aerospace & Defense: Avionics and communication systems demanding reliability under thermal cycling.

Conclusion of GUS-SS8B-01-3830-DD

The GUS-SS8B-01-3830-DD stands out for its precision, power efficiency, and compact design, making it a superior choice over thicker-film or less stable alternatives. Its combination of tight tolerances, thin-film reliability, and robust packaging caters to industries where performance cannot be compromised. Engineers will appreciate its balance of space savings, thermal resilience, and ease of integration in high-reliability applications.