TT Electronics/IRC

GUS-SS8B-01-4221-FD

GUS-SS8B-01-4221-FD Description

The GUS-SS8B-01-4221-FD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 4.22KΩ resistance value and a tight 1% tolerance, ensuring reliable signal conditioning and voltage division. With a 0.8W total power rating (0.05W per resistor) and a ±100ppm/°C temperature coefficient, it delivers stable performance across a wide temperature range of 70°C to 125°C. The gull-wing termination and surface-mount design facilitate easy PCB integration, while its 100V maximum voltage rating makes it suitable for robust circuit protection.

GUS-SS8B-01-4221-FD Features

• Precision Thin Film Technology: Ensures low noise and high accuracy for sensitive analog/digital circuits.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length).
• High Power Handling: 0.8W total dissipation (1/20W per resistor) at 125°C maximum operating temperature.
• Stable Thermal Performance: ±100ppm/°C TCR minimizes resistance drift under thermal stress.
• Automated Assembly Friendly: Gull-wing leads and 1.27mm pitch enable high-speed SMT placement.
• Non-Automotive (PPAP No): Ideal for industrial, telecom, and instrumentation applications.

GUS-SS8B-01-4221-FD Applications

• Signal Conditioning: Precision voltage dividers in ADC/DAC circuits.
• Medical Electronics: Patient monitoring systems requiring stable resistance values.
• Test & Measurement Equipment: Calibration networks for high-accuracy instruments.
• Industrial Controls: Feedback networks in motor drives and power supplies.
• Telecom Infrastructure: Line termination and impedance matching in high-frequency PCBs.

Conclusion of GUS-SS8B-01-4221-FD

The GUS-SS8B-01-4221-FD excels in precision, power efficiency, and thermal stability, making it a superior choice for applications demanding tight tolerances and reliability. Its thin-film construction and SOIC packaging offer a balance of performance and manufacturability, while the non-automotive compliance focuses on industrial and telecom markets. Engineers will appreciate its robust design and consistent performance in critical circuits.