TT Electronics/IRC

GUS-SS8B-01-5102-GF

GUS-SS8B-01-5102-GF Description

The GUS-SS8B-01-5102-GF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC (Small Outline Integrated Circuit) package features 15 resistors with a 51K Ohm resistance value, 2% tolerance, and a ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this surface-mount (SMD) network is ideal for compact, high-density PCB designs. Its gull-wing termination and 1.27mm terminal pitch facilitate reliable soldering and automated assembly.

GUS-SS8B-01-5102-GF Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive circuits.
• Robust Construction: SOIC package (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• High Power Handling: 0.8W total dissipation (0.05W per resistor) at 125°C maximum operating temperature.
• Wide Compatibility: BUS circuit designator simplifies integration into bus-line applications.
• Non-Automotive, Non-PPAP: Suitable for industrial, telecom, and consumer electronics.
• Non-RoHS Compliant: For applications exempt from RoHS restrictions.

GUS-SS8B-01-5102-GF Applications

• Analog/Digital Signal Conditioning: Precision voltage dividers, pull-up/pull-down networks.
• Embedded Systems: Microcontroller I/O protection, sensor interfacing.
• Test & Measurement Equipment: Calibration circuits, reference networks.
• Communication Devices: Impedance matching in RF/analog front-ends.
• Power Management: Feedback networks in DC-DC converters.

Conclusion of GUS-SS8B-01-5102-GF

The GUS-SS8B-01-5102-GF excels in precision, power efficiency, and compactness, making it a superior choice for high-density, high-reliability designs. Its thin-film technology and tight tolerances outperform carbon or thick-film alternatives in stability and noise performance. While not suited for automotive or RoHS-mandated projects, it is ideal for industrial, telecom, and instrumentation applications demanding consistent performance under thermal stress. Packaged in tubes for automated assembly, it streamlines manufacturing while reducing footprint.