TT Electronics/IRC

GUS-SS8B-01-5230-FD

GUS-SS8B-01-5230-FD Description

The GUS-SS8B-01-5230-FD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount circuits. This 16-pin SOIC package integrates 15 resistors, each with a 523Ω resistance value and a tight 1% tolerance, ensuring reliable signal conditioning and voltage division. Rated for 0.8W total power dissipation (0.05W per resistor), it operates across a wide temperature range of 70°C to 125°C, making it suitable for demanding environments. The thin-film technology provides excellent stability with a ±100ppm/°C temperature coefficient, while the gull-wing termination ensures robust solderability in automated assembly processes.

GUS-SS8B-01-5230-FD Features

• Precision Resistance: 15 resistors, each 523Ω ±1%, ideal for matched impedance applications.
• High Power Handling: 0.8W total power rating with derating up to 125°C.
• Stable Performance: Thin-film construction ensures low noise and ±100ppm/°C TCR for minimal drift.
• Robust Packaging: SOIC-16 case with 1.27mm terminal pitch, compliant with automated SMD placement.
• Wide Voltage Rating: Supports up to 100V, suitable for industrial and instrumentation circuits.
• Mechanical Precision: Tight dimensional tolerances (±0.1mm height/length, ±0.2mm depth) for consistent PCB fit.

GUS-SS8B-01-5230-FD Applications

This resistor network excels in:

• Analog Signal Processing: Voltage dividers, gain networks, and feedback circuits in op-amp systems.
• Industrial Controls: PLCs, sensor interfaces, and power management modules requiring stable resistance.
• Test & Measurement Equipment: Precision calibration circuits and instrumentation amplifiers.
• Telecommunications: Impedance matching and termination in high-frequency signal paths.
• Automotive & Aerospace (non-PPAP): Non-safety-critical systems where thin-film reliability is prioritized.

Conclusion of GUS-SS8B-01-5230-FD

The GUS-SS8B-01-5230-FD combines precision, power efficiency, and thermal resilience in a compact SOIC package. Its thin-film technology and tight tolerances make it superior to thick-film alternatives in applications demanding long-term stability. While not PPAP-compliant, it is a cost-effective solution for industrial and telecom designs where consistent performance under thermal stress is critical. The tube packaging ensures protection during shipping and handling, streamlining high-volume production.