TT Electronics/IRC

GUS-SS8B-01-5231-GF

GUS-SS8B-01-5231-GF Description

The GUS-SS8B-01-5231-GF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC surface-mount device (SMD) integrates 15 resistors with a 5.23KΩ resistance value, offering a tight 2% tolerance and a low ±100ppm/°C temperature coefficient. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it operates reliably across a wide temperature range of 70°C to 125°C. The gull-wing termination ensures secure PCB mounting, while the compact 9.91mm x 5.99mm x 1.45mm footprint suits space-constrained designs.

GUS-SS8B-01-5231-GF Features

• Precision Thin Film Technology: Delivers stable performance with minimal drift.
• High-Density Integration: 15 resistors in a 16-pin SOIC package optimize board space.
• Robust Power Handling: 0.8W total dissipation (derated up to 125°C) for demanding circuits.
• Low TCR: ±100ppm/°C ensures consistency across temperature fluctuations.
• Automated Assembly Friendly: Gull-wing leads and 1.27mm pitch simplify SMD placement.
• Non-Automotive/Non-PPAP: Ideal for industrial, telecom, and instrumentation applications.
• Strict Dimensional Tolerances: ±0.1mm (L/H) and ±0.2mm (D) for precise PCB alignment.

GUS-SS8B-01-5231-GF Applications

This resistor network excels in:

• Voltage Divider Circuits: Precision resistance matching for signal conditioning.
• ADC/DAC Interfaces: Stable reference networks in data acquisition systems.
• Industrial Control Systems: Reliable performance in harsh environments (up to 125°C).
• Telecommunication Hardware: Low-noise, high-accuracy signal processing.
• Test & Measurement Equipment: Critical for calibration and sensor networks.

Conclusion of GUS-SS8B-01-5231-GF

The GUS-SS8B-01-5231-GF combines precision, power efficiency, and compactness, making it a superior choice for engineers prioritizing thermal stability and space savings. While not PPAP-compliant or automotive-grade, its thin-film technology and tight tolerances cater to high-reliability industrial and telecom applications. Its SOIC package and gull-wing leads further enhance manufacturability, solidifying its role in advanced electronic systems.