TT Electronics/IRC

GUS-SS8B-01-5360-JG

GUS-SS8B-01-5360-JG Description

The GUS-SS8B-01-5360-JG from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin SOIC package integrates 15 resistors with a 536Ω resistance value, offering a 5% tolerance and a ±100ppm/°C temperature coefficient. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it operates reliably across a wide temperature range of 70°C to 125°C. The gull-wing termination and surface-mount design ensure easy integration into compact PCB layouts, while its rectangular SOIC case (9.91mm x 5.99mm x 1.45mm) adheres to tight dimensional tolerances (±0.1mm height, ±0.2mm depth).

GUS-SS8B-01-5360-JG Features

• Thin-Film Technology: Delivers superior stability, low noise, and precise resistance matching.
• High Power Density: 0.8W total dissipation in a compact SOIC-16 package, ideal for space-constrained designs.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
• Robust Construction: Gull-wing leads provide mechanical strength and solderability for automated assembly.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• Non-Automotive (PPAP No): Suitable for industrial, telecom, and instrumentation use.

GUS-SS8B-01-5360-JG Applications

• Signal Conditioning: Precision voltage dividers in ADC/DAC circuits.
• Bus Termination: Impedance matching for high-speed data lines (e.g., SPI, I2C).
• Industrial Controls: Stable resistance in PLCs, sensor interfaces, and power management.
• Telecom Equipment: Reliable performance in RF modules and baseband processing.
• Test & Measurement: Low-drift networks for calibration and reference circuits.

Conclusion of GUS-SS8B-01-5360-JG

The GUS-SS8B-01-5360-JG excels in applications requiring tight tolerance, thermal stability, and compact form factors. Its thin-film technology and SOIC packaging make it a superior choice over thick-film alternatives in precision environments. While non-compliant with EU RoHS, it remains a robust solution for industrial and telecom systems where reliability under thermal stress is critical. Engineers will appreciate its balance of performance, power handling, and ease of integration in high-density designs.