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GUS-SS8B-01-53R6-FD
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GUS-SS8B-01-53R6-FD Description
GUS-SS8B-01-53R6-FD Description
The GUS-SS8B-01-53R6-FD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC package integrates 15 resistors, each with a 53.6 Ω resistance and a tight 1% tolerance, ensuring reliable performance in precision circuits. With a 0.8W total power rating (0.05W per resistor) and a ±100ppm/°C temperature coefficient, it delivers stable operation across a wide temperature range of -70°C to +125°C. The gull-wing termination and 100V maximum voltage rating make it suitable for automated PCB assembly and high-voltage environments. Packaged in a tube, this non-automotive, non-PPAP compliant component is ideal for industrial and commercial electronics.
GUS-SS8B-01-53R6-FD Features
- Precision Thin Film Technology: Ensures low noise and high stability.
- Compact SOIC Package: 9.91mm × 5.99mm × 1.45mm dimensions with ±0.1mm length/height tolerances for space-constrained designs.
- High Power Handling: 0.8W total (0.05W per resistor) with derating up to 125°C.
- Wide Operating Range: -70°C to +125°C for harsh environments.
- 1% Tolerance & ±100ppm/°C TCR: Superior accuracy compared to thick-film alternatives.
- Gull-Wing SMD Termination: Facilitates reliable soldering and inspection.
- Non-RoHS Compliant: Suitable for legacy or exempted applications.
GUS-SS8B-01-53R6-FD Applications
- Voltage Division & Pull-Up Networks: Precision resistor arrays for ADC/DAC circuits.
- Industrial Control Systems: Stable performance in PLCs and sensor interfaces.
- Test & Measurement Equipment: Low-drift resistance for calibration modules.
- Power Management Circuits: Voltage balancing in multi-channel designs.
- Legacy Electronics: Non-RoHS compliance aligns with older system requirements.
Conclusion of GUS-SS8B-01-53R6-FD
The GUS-SS8B-01-53R6-FD excels in precision, power efficiency, and thermal stability, making it a robust choice for industrial, instrumentation, and high-voltage applications. Its thin-film construction and tight tolerances outperform generic thick-film networks, while the SOIC-16 package ensures compatibility with standard SMD processes. Though not suited for automotive use, its reliability in extreme temperatures and low TCR solidify its position in professional electronics design.



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