TT Electronics/IRC

GUS-SS8B-01-5490-JD

GUS-SS8B-01-5490-JD Description

The GUS-SS8B-01-5490-JD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin SOIC package features 15 resistors with a 549Ω resistance value, 5% tolerance, and a ±100ppm/°C temperature coefficient, ensuring stable performance across a wide temperature range (70°C to 125°C). With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, this network is engineered for reliability in demanding circuits. Its gull-wing termination and 1.27mm terminal pitch facilitate easy soldering and high-density mounting.

GUS-SS8B-01-5490-JD Features

• Precision Thin Film Technology: Delivers low noise and high stability for sensitive analog/digital circuits.
• Robust Construction: SOIC package (9.91mm x 5.99mm x 1.45mm) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• Wide Operating Range: Rated for -55°C to +125°C, derated to 70°C to 125°C at full power.
• High Power Density: 0.8W total dissipation (0.05W per resistor) in a compact footprint.
• Automation-Friendly: Tube packaging ensures compatibility with pick-and-place systems.
• Non-Automotive/Non-PPAP: Ideal for industrial and commercial applications where PPAP compliance is not required.

GUS-SS8B-01-5490-JD Applications

• Voltage Division & Pull-Up/Down Networks: Ensures consistent signal integrity in digital logic circuits.
• Sensor Interface Circuits: Stable resistance for precision analog signal conditioning (e.g., thermocouples, strain gauges).
• Power Management Modules: Reliable current limiting in DC-DC converters and voltage regulators.
• Communication Systems: Impedance matching in RF/analog front-end designs.
• Test & Measurement Equipment: Low-drift performance for calibration and reference circuits.

Conclusion of GUS-SS8B-01-5490-JD

The GUS-SS8B-01-5490-JD excels in applications demanding tight tolerance, low thermal drift, and high power efficiency in a space-optimized format. While not RoHS-compliant, its thin-film technology and rugged SOIC package make it a preferred choice for industrial, telecom, and instrumentation designs. Engineers will appreciate its balance of performance, durability, and ease of integration, particularly in high-density PCBs where reliability under thermal stress is critical.