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GUS-SS8B-01-5600-JD
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GUS-SS8B-01-5600-JD Description
GUS-SS8B-01-5600-JD Description
The GUS-SS8B-01-5600-JD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. Encased in a 16-pin SOIC package with gull-wing terminations, this 560 Ohm, 5% tolerance network features 15 resistors in a compact 9.91 x 5.99 x 1.45 mm footprint. Its thin-film technology ensures low noise and excellent stability, with a ±100 ppm/°C temperature coefficient and a 0.8W total power rating (0.05W per resistor). Rated for 125°C maximum operating temperature, it supports derated operation up to 70–125°C, making it suitable for environments requiring thermal resilience.
GUS-SS8B-01-5600-JD Features
- Precision Thin Film: Delivers consistent performance with low TCR (±100 ppm/°C) and tight tolerance (±5%).
- Robust Construction: SOIC-16 package with gull-wing leads ensures reliable surface-mount (SMD) assembly.
- High Power Handling: 0.8W total dissipation (0.05W/resistor) at 100V max voltage, ideal for power-sensitive designs.
- Wide Thermal Range: Operates from 70°C to 125°C (derated), exceeding standard commercial-grade limits.
- BUS Configuration: Optimized for bus termination, pull-up/down networks, and voltage division in analog/digital systems.
- Non-Automotive/Non-PPAP: Suitable for industrial, telecom, and instrumentation applications where PPAP compliance isn’t required.
GUS-SS8B-01-5600-JD Applications
- Signal Conditioning: Precision resistor networks for ADC/DAC interfaces.
- Bus Termination: Impedance matching in high-speed digital circuits (e.g., memory buses).
- Voltage Dividers: Stable reference networks in sensor interfaces.
- Industrial Electronics: Control systems, PLCs, and power management PCBs requiring thermal stability.
- Telecom Infrastructure: Line termination and filtering in communication hardware.
Conclusion of GUS-SS8B-01-5600-JD
The GUS-SS8B-01-5600-JD excels in applications demanding compact size, thermal endurance, and electrical precision. Its thin-film technology, high power rating, and robust SOIC package make it a superior choice over thicker-film or less stable alternatives. While not RoHS-compliant, it remains ideal for industrial and professional electronics where reliability under thermal stress is critical. Engineers will value its balance of performance, durability, and ease of integration in space-constrained designs.



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