TT Electronics/IRC

GUS-SS8B-01-5601-FD

GUS-SS8B-01-5601-FD Description

The GUS-SS8B-01-5601-FD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 5.6K Ohm resistance and a tight 1% tolerance, ensuring consistent performance in demanding circuits. With a ±100ppm/°C temperature coefficient and a 0.8W total power rating, it delivers stable operation across a wide temperature range (70°C to 125°C). The gull-wing termination and surface-mount design facilitate easy PCB integration, while the 100V maximum voltage rating enhances reliability in high-voltage environments.

GUS-SS8B-01-5601-FD Features

• Precision Thin Film Technology: Offers superior stability and low noise compared to thick-film alternatives.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• High Power Handling: 0.05W per resistor (1/20W) and 0.8W total, ideal for power-sensitive designs.
• Wide Operating Range: Rated for -55°C to +125°C, with derated power up to 125°C.
• Automotive-Grade Alternatives: While this model is not PPAP or automotive-qualified, its robustness suits industrial and telecom applications.
• Non-RoHS Compliant: Suitable for legacy systems where RoHS exemptions apply.

GUS-SS8B-01-5601-FD Applications

• Signal Conditioning: Precision voltage dividers in sensor interfaces.
• Analog Circuits: Feedback networks in op-amp configurations.
• Industrial Controls: PLCs and motor drives requiring stable resistance under thermal stress.
• Telecom Hardware: Line termination and impedance matching in communication modules.
• Test & Measurement Equipment: Calibration circuits demanding low TCR and high accuracy.

Conclusion of GUS-SS8B-01-5601-FD

The GUS-SS8B-01-5601-FD excels in precision, power efficiency, and compactness, making it a top choice for engineers needing reliable resistor networks in industrial, telecom, and instrumentation systems. Its thin-film construction, tight tolerances, and robust SOIC package provide a competitive edge over generic arrays, particularly in environments with thermal fluctuations or space constraints. For non-automotive applications requiring high-density resistance solutions, this model delivers exceptional performance and longevity.