TT Electronics/IRC

GUS-SS8B-01-5762-JD

GUS-SS8B-01-5762-JD Description

The GUS-SS8B-01-5762-JD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in surface-mount PCB assemblies. This 16-pin SOIC device integrates 15 resistors, each with a 57.6KΩ resistance (5% tolerance), arranged in a BUS configuration. It delivers a total power rating of 0.8W (0.05W per resistor) and operates across a wide temperature range of 70°C to 125°C, with a maximum operating temperature of 125°C. The ±100ppm/°C temperature coefficient ensures stable performance under thermal stress. Encased in a rectangular SOIC package, it features gull-wing terminations for reliable SMD mounting, with a compact footprint of 9.91mm (L) × 5.99mm (D) × 1.45mm (H) and tight dimensional tolerances (±0.1mm height/length, ±0.2mm depth).

GUS-SS8B-01-5762-JD Features

• Precision Thin Film Technology: Offers low noise and high stability for sensitive circuits.
• High-Density Integration: 15 resistors in a compact SOIC-16 package, saving board space.
• Robust Power Handling: 0.8W total dissipation (0.05W per resistor) at 100V max rating.
• Wide Temperature Range: Reliable operation from 70°C to 125°C with derated power.
• Stable TCR: ±100ppm/°C ensures minimal resistance drift.
• Automated Assembly Friendly: Gull-wing leads and 1.27mm pitch enable high-speed SMD placement.
• Non-Automotive/Non-PPAP: Ideal for industrial and commercial applications.

GUS-SS8B-01-5762-JD Applications

• Signal Conditioning: Voltage dividers, pull-up/pull-down networks in IoT devices and sensors.
• Analog Circuits: Precision gain setting in op-amp stages and ADC/DAC interfaces.
• Power Management: Current limiting in low-power DC/DC converters.
• Industrial Controls: PLC modules and instrumentation requiring stable resistance under thermal cycling.
• Consumer Electronics: Audio equipment and display drivers where space efficiency is critical.

Conclusion of GUS-SS8B-01-5762-JD

The GUS-SS8B-01-5762-JD excels in high-density, precision applications demanding thermal stability and compact design. Its thin-film construction, BUS configuration, and robust SOIC package make it superior to thicker-film or discrete alternatives in noise-sensitive or space-constrained designs. While not compliant with EU RoHS or automotive standards, it is a cost-effective solution for industrial, commercial, and consumer electronics where reliability and performance are paramount.