TT Electronics/IRC

GUS-SS8B-01-57R6-DD

GUS-SS8B-01-57R6-DD Description

The GUS-SS8B-01-57R6-DD from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC device integrates 15 resistors with a 57.6Ω resistance value, offering a tight ±0.5% tolerance and a low ±100ppm/°C temperature coefficient. Rated for 0.8W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of -70°C to +125°C, making it suitable for environments requiring stability under thermal stress. The gull-wing termination ensures secure PCB mounting, while the 100V maximum voltage rating enhances its versatility in various circuit designs.

GUS-SS8B-01-57R6-DD Features

• Precision Performance: Thin-film technology delivers low noise and high accuracy (0.5% tolerance), ideal for signal conditioning and analog circuits.
• Robust Construction: SOIC package (9.91mm x 5.99mm x 1.45mm) with ±0.1mm length/height tolerances ensures consistent mechanical fit.
• Thermal Resilience: Operates at derated power up to 125°C, outperforming standard networks in high-temperature applications.
• BUS Circuit Design: Optimized for bus termination, voltage division, and pull-up/down networks in digital systems.
• Non-Automotive Compliance: Excludes PPAP, making it cost-effective for industrial and consumer electronics.

GUS-SS8B-01-57R6-DD Applications

• Signal Integrity: Used in ADC/DAC reference circuits, sensor interfaces, and precision instrumentation.
• Digital Systems: Ideal for bus termination in memory modules, FPGAs, and communication PCBs to reduce reflections.
• Power Management: Supports voltage dividers in DC-DC converters and feedback loops.
• Test Equipment: Ensures stable resistance in calibration devices and measurement tools.

Conclusion of GUS-SS8B-01-57R6-DD

The GUS-SS8B-01-57R6-DD combines precision, thermal stability, and compact design, making it a superior choice for engineers needing reliable resistor networks. Its thin-film technology and BUS-oriented design address challenges in high-frequency and high-temperature environments, while the SOIC package simplifies assembly. Though not RoHS-compliant, its performance in industrial and telecom applications justifies its use where regulatory flexibility exists. For designs demanding tight tolerances and repeatability, this network delivers exceptional value.