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GUS-SS8B-01-7502-DC
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GUS-SS8B-01-7502-DC Description
GUS-SS8B-01-7502-DC Description
The GUS-SS8B-01-7502-DC from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. This 16-pin SOIC device integrates 15 resistors with a 75K Ohm resistance value, offering a tight 0.5% tolerance and a low ±100ppm/°C temperature coefficient. Rated for 0.8W total power dissipation (0.05W per resistor), it operates reliably across a wide temperature range of -70°C to +125°C, with a maximum voltage rating of 100V. Its gull-wing termination ensures secure PCB mounting, while the compact 9.91mm x 5.99mm x 1.45mm footprint suits space-constrained designs.
GUS-SS8B-01-7502-DC Features
- Precision Performance: Thin-film technology delivers ±0.5% tolerance and ±100ppm/°C stability, ideal for signal conditioning and analog circuits.
- Robust Construction: SOIC package with gull-wing leads enhances mechanical durability and solderability.
- High Power Handling: 0.8W total power rating (1/20W per resistor) supports energy-efficient designs.
- Wide Operating Range: Functions from -70°C to +125°C, suitable for industrial and automotive environments (though not PPAP/automotive-certified).
- Space-Saving Design: Ultra-low profile (1.45mm height) and 1.27mm terminal pitch optimize PCB real estate.
- Non-RoHS Compliance: Suitable for legacy or specialized applications requiring non-compliant materials.
GUS-SS8B-01-7502-DC Applications
- Signal Processing: Precision voltage dividers, DAC/ADC interfaces, and feedback networks in test equipment.
- Industrial Controls: Sensor calibration, PLCs, and power management circuits requiring stable resistance.
- Medical Devices: Low-noise analog front-ends where accuracy is critical.
- Telecom Infrastructure: Line termination and impedance matching in high-frequency modules.
- Legacy Systems: Upgrades or repairs for non-RoHS-compliant electronics.
Conclusion of GUS-SS8B-01-7502-DC
The GUS-SS8B-01-7502-DC excels in precision and reliability, leveraging thin-film technology for applications demanding tight tolerances and thermal stability. Its compact SOIC package, high power rating, and broad temperature range make it a versatile choice for industrial, medical, and telecom systems. While not automotive-grade, its performance and durability position it as a superior alternative for non-RoHS designs. Engineers will appreciate its balance of accuracy, power efficiency, and space-saving form factor.



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