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GUS-SS8B-01-7680-JC
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GUS-SS8B-01-7680-JC Description
GUS-SS8B-01-7680-JC Description
The GUS-SS8B-01-7680-JC from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications in demanding electronic circuits. This 16-pin SOIC package integrates 15 resistors with a 768Ω resistance value (5% tolerance) and delivers a total power rating of 0.8W (0.05W per resistor). Optimized for surface-mount (SMD) assembly, it features gull-wing termination for reliable solder joints and mechanical stability. The device operates over a wide temperature range (-70°C to +125°C) with a low ±100ppm/°C temperature coefficient, ensuring stable performance in thermally variable environments. Its compact dimensions (9.91mm x 5.99mm x 1.45mm) and ±0.1mm height tolerance make it ideal for space-constrained PCB designs.
GUS-SS8B-01-7680-JC Features
- High-Density Integration: 15 resistors in a 16-pin SOIC package, reducing PCB footprint.
- Precision Thin-Film Technology: Delivers low noise, high stability, and tight tolerance (±5%).
- Robust Power Handling: 0.8W total power dissipation with derating up to 125°C.
- Wide Voltage Rating: Supports up to 100V, suitable for industrial and automotive (non-PPAP) applications.
- Mechanical Reliability: Gull-wing terminals and ±0.1mm length/height tolerances ensure consistent mounting.
- Non-RoHS Compliant: Suitable for legacy or specialized systems where RoHS exemptions apply.
GUS-SS8B-01-7680-JC Applications
- Analog Signal Conditioning: Precision voltage dividers in sensor interfaces.
- Industrial Control Systems: Feedback networks in motor drives and power supplies.
- Test & Measurement Equipment: Stable reference resistors for calibration circuits.
- Telecommunications: Impedance matching in RF modules and signal processing.
- Legacy Electronics: Repair or replacement in military/aerospace systems (non-automotive).
Conclusion of GUS-SS8B-01-7680-JC
The GUS-SS8B-01-7680-JC excels in high-density, precision resistor networks, offering thermal stability, compact design, and robust power handling. Its thin-film technology and tight tolerances make it superior to thick-film alternatives in critical analog circuits. While not automotive-grade, it is ideal for industrial, telecom, and legacy systems requiring reliable performance under thermal stress. For engineers prioritizing space efficiency and electrical consistency, this model is a compelling choice.



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