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GUS-SS8B-01-8252-D
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GUS-SS8B-01-8252-D Description
GUS-SS8B-01-8252-D Description
The GUS-SS8B-01-8252-D from TT Electronics/IRC is a high-precision thin-film resistor network designed for demanding surface-mount applications. Encased in a 16-pin SOIC package with gull-wing terminations, this device integrates 15 resistors with a uniform 82.5KΩ resistance value, offering a tight tolerance of ±0.5% and a low temperature coefficient of ±100ppm/°C. Its 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating ensure reliable performance in compact, high-density circuits. The SOIC package (9.91mm × 5.99mm × 1.45mm) features a rectangular form factor with tight dimensional tolerances (±0.1mm height/length, ±0.2mm depth), making it suitable for automated assembly.
GUS-SS8B-01-8252-D Features
- Precision Thin Film Technology: Delivers stable performance with ±0.5% tolerance and ±100ppm/°C TCR, ideal for precision analog circuits.
- Robust Construction: SOIC-16 package with gull-wing leads ensures mechanical durability and solderability.
- High Power Density: 0.8W total dissipation (0.05W per resistor) supports compact designs without thermal compromise.
- Wide Temperature Range: Operates from 70°C to 125°C (derated) with a 125°C maximum rating, suitable for industrial environments.
- BUS Circuit Designator: Optimized for bus termination, voltage division, or pull-up/down applications.
- Non-Automotive, Non-PPAP: Compliant with EAR99 and HTS 8533.21.00.20, but not RoHS-compliant.
GUS-SS8B-01-8252-D Applications
- Signal Conditioning: Precision voltage dividers in data acquisition systems.
- Bus Termination: Impedance matching for high-speed digital buses (e.g., DDR, PCIe).
- Medical Electronics: Low-drift networks for sensor interfaces or instrumentation amplifiers.
- Industrial Controls: Stable resistance in PLCs, motor drives, and power management circuits.
- Test & Measurement: Calibration circuits requiring long-term stability.
Conclusion of GUS-SS8B-01-8252-D
The GUS-SS8B-01-8252-D excels in applications demanding high precision, compactness, and thermal resilience. Its thin-film technology, tight tolerances, and robust SOIC package make it a superior choice over thicker-film or less stable alternatives. While not suited for automotive use, it is ideal for industrial, medical, and test equipment where reliability and accuracy are critical. The tube packaging ensures protection during handling and assembly, further enhancing its appeal for high-volume production.



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