TT Electronics/IRC

GUS-SS8B-02-1101-G

GUS-SS8B-02-1101-G Description

The GUS-SS8B-02-1101-G from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 1.1KΩ resistance value and a tight 2% tolerance, ensuring consistent performance in demanding circuits. With a 0.8W total power rating (0.05W per resistor) and a ±50ppm/°C temperature coefficient, it delivers stable operation across a wide temperature range of 70°C to 125°C. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the 100V maximum voltage rating enhances reliability in high-voltage environments.

GUS-SS8B-02-1101-G Features

• Precision Thin Film Technology: Offers low noise and high stability for sensitive analog/digital circuits.
• Compact SOIC Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with tight tolerances (±0.1mm L/H, ±0.2mm D), ideal for space-constrained designs.
• Robust Performance: Operates at 125°C max with derated power up to 125°C, suited for industrial environments.
• BUS Circuit Designator: Optimized for bus termination, voltage division, and pull-up/down applications.
• Non-Automotive, Non-PPAP: Tailored for commercial and industrial use where PPAP compliance is not required.
• Non-RoHS: Suitable for legacy systems or applications exempt from RoHS restrictions.

GUS-SS8B-02-1101-G Applications

This resistor network excels in:

• Signal Conditioning: Precision voltage dividers and feedback networks in instrumentation.
• Bus Termination: Impedance matching for high-speed data lines (e.g., SPI, I²C).
• Industrial Controls: Stable performance in PLCs, motor drives, and power supplies.
• Legacy Electronics: Repair or replication of older PCB designs requiring non-RoHS components.

Conclusion of GUS-SS8B-02-1101-G

The GUS-SS8B-02-1101-G combines precision, compactness, and reliability, making it a standout choice for engineers needing stable resistor networks in non-automotive settings. Its thin-film construction, tight tolerances, and high-temperature resilience address critical challenges in industrial and commercial electronics, while the SOIC gull-wing package ensures compatibility with standard SMD assembly processes. For designs demanding consistent resistance values under thermal stress, this model offers a cost-effective, high-performance solution.