TT Electronics/IRC

GUS-SS8B-02-1101-JF

GUS-SS8B-02-1101-JF Description

The GUS-SS8B-02-1101-JF from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC (Small Outline Integrated Circuit) package features 15 resistors with a 1.1K Ohm resistance value and a 5% tolerance, making it ideal for signal conditioning, voltage division, and impedance matching. The device operates within a temperature range of 70 to 125°C and offers a ±50ppm/°C temperature coefficient, ensuring stable performance under varying thermal conditions. With a 0.8W total power rating (0.05W per resistor) and a 100V maximum voltage rating, it is suited for low-power, high-reliability circuits. The gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GUS-SS8B-02-1101-JF Features

• Thin-Film Technology: Delivers superior accuracy and stability compared to thick-film alternatives.
• Compact SOIC Package: Measures 9.91mm (L) x 5.99mm (D) x 1.45mm (H) with tight tolerances (±0.1mm height/length, ±0.2mm depth).
• High Power Density: 0.8W total dissipation across 15 resistors in a minimal footprint.
• Wide Temperature Range: Reliable operation from 70°C to 125°C with derated power.
• Automotive-Grade Alternatives: While not automotive-qualified (PPAP: No), its robustness suits industrial and telecom applications.
• Non-RoHS Compliant: Suitable for legacy or exempted designs requiring leaded components.

GUS-SS8B-02-1101-JF Applications

• Precision Analog Circuits: Voltage dividers, feedback networks in op-amp circuits.
• Signal Processing: DAC/ADC interfaces, sensor signal conditioning.
• Industrial Controls: PLCs, motor drives, and power management systems.
• Telecommunications: Line termination, impedance matching in RF modules.
• Test & Measurement Equipment: Calibration networks, reference voltage generation.

Conclusion of GUS-SS8B-02-1101-JF

The GUS-SS8B-02-1101-JF excels in space-constrained, precision applications requiring stable resistance values under thermal stress. Its thin-film construction, SOIC packaging, and gull-wing terminals offer a balance of performance and manufacturability. While not suited for automotive or RoHS-mandated designs, it remains a cost-effective solution for industrial, telecom, and instrumentation sectors. Engineers will appreciate its repeatability, power handling, and ease of integration, making it a versatile choice for complex resistor network requirements.