TT Electronics/IRC

GUS-SS8B-02-1241-J

GUS-SS8B-02-1241-J Description

The GUS-SS8B-02-1241-J from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC device integrates 15 resistors, each with a 1.24KΩ resistance value and a 5% tolerance, ensuring reliable performance in compact circuit designs. With a ±50ppm/°C temperature coefficient, it delivers stable operation across a wide temperature range (70°C to 125°C). The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for demanding environments. Its gull-wing termination and surface-mount design facilitate easy PCB integration, while the tube packaging ensures safe handling and storage.

GUS-SS8B-02-1241-J Features

• Thin-Film Technology: Offers superior stability, low noise, and precise resistance matching.
• High-Density Integration: 15 resistors in a compact 9.91mm × 5.99mm × 1.45mm SOIC package, ideal for space-constrained designs.
• Robust Performance: Operates at 125°C max with derated power up to 125°C, ensuring reliability in harsh conditions.
• Low TCR: ±50ppm/°C minimizes resistance drift over temperature variations.
• Automotive-Grade Alternatives: While not PPAP or automotive-certified, its performance rivals qualified components for industrial use.
• Non-RoHS Compliant: Suitable for legacy or specialized applications requiring non-compliant materials.

GUS-SS8B-02-1241-J Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers and sensor interfaces in test equipment.
• Industrial Control Systems: Durable performance in PLCs, motor drives, and power supplies.
• Communication Hardware: Impedance matching and termination in RF modules and base stations.
• Medical Electronics: Stable operation in diagnostic devices where consistency is critical.
• Legacy Equipment Upgrades: Direct replacement for non-RoHS compliant systems.

Conclusion of GUS-SS8B-02-1241-J

The GUS-SS8B-02-1241-J combines high precision, compact design, and thermal resilience, making it a versatile choice for engineers prioritizing reliability in industrial and communication systems. Its thin-film construction and tight tolerances outperform standard thick-film networks, while the SOIC package ensures compatibility with automated assembly processes. For applications demanding stable resistance under thermal stress, this model stands out as a cost-effective, high-performance solution.