TT Electronics/IRC

GUS-SS8B-02-1601-GD

GUS-SS8B-02-1601-GD Description

The GUS-SS8B-02-1601-GD from TT Electronics/IRC is a high-performance thin-film resistor network designed for precision applications. This 16-pin SOIC package integrates 15 resistors, each with a 1.6KΩ resistance value and a tight 2% tolerance, ensuring consistent performance in demanding circuits. With a ±50ppm/°C temperature coefficient, it delivers excellent stability across a wide operating range of 70°C to 125°C. The 0.8W total power rating (0.05W per resistor) and 100V maximum voltage rating make it suitable for compact, power-sensitive designs. Its gull-wing termination and surface-mount (SMD) compatibility facilitate efficient PCB assembly.

GUS-SS8B-02-1601-GD Features

• Precision Thin Film Technology: Ensures low noise and high accuracy (±2% tolerance).
• Robust Power Handling: 0.8W total dissipation (0.05W per resistor) with derating up to 125°C.
• Stable Thermal Performance: ±50ppm/°C TCR minimizes resistance drift.
• Compact SOIC-16 Package: Measures 9.91mm (L) × 5.99mm (D) × 1.45mm (H) with ±0.1mm dimensional tolerances.
• Gull-Wing SMD Termination: Enables reliable soldering for automated PCB assembly.
• Non-Automotive, Non-PPAP: Ideal for industrial and commercial applications.
• 100V Maximum Voltage Rating: Suitable for low-to-medium voltage circuits.

GUS-SS8B-02-1601-GD Applications

This resistor network excels in:

• Analog Signal Conditioning: Precision voltage dividers, sensor interfaces.
• Medical Electronics: Patient monitoring systems requiring stable resistance.
• Test & Measurement Equipment: Calibration circuits, DAQ systems.
• Telecom Infrastructure: Line termination, impedance matching.
• Industrial Control Systems: PLCs, motor drives with space constraints.

Conclusion of GUS-SS8B-02-1601-GD

The GUS-SS8B-02-1601-GD combines thin-film precision, thermal stability, and compact SMD packaging, making it a superior choice for applications demanding reliability in harsh environments. While not RoHS-compliant, its high power density and low TCR outperform similar thick-film networks. Engineers will value its repeatable performance in critical analog and mixed-signal designs.